IPC TR-462:1987
$32.50
Solderability Evaluation of Printed Boards with Protective Coatings over a Long Term Storage
Published By | Publication Date | Number of Pages |
IPC | 1987-10-01 | 74 |
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The Round Robin Test Program had the following objectives.
- Determine the effectiveness of different protective coatings, and methods of coating application, on printed wiring boards.
- Coatings were to be applied over a variety of conductor patterns, land configurations, plated and non-plated holes, on PWBs with and without solder mask.
- Provide insight into PWB solderability after various time periods in typical storage conditions, and correlate this data with the thickness and characteristics of the coating.
- Determine if various patterns of conductors, lands, spacing and configuration contributed to the soldering characteristics.
Published Code | IPC |
---|---|
Published By | IPC International Inc, formerly Institute for Printed Circuits |
Publication Date | 1987-10-01 |
Pages Count | 74 |
Language | English |
File Size | 5.9 MB |
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