IPC TR-579:1988
$37.05
Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards
Published By | Publication Date | Number of Pages |
IPC | 1988-09-01 | 90 |
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Approximately 200,000 plated through-holes, covering primarily electroplated but also electroless technology, were exposed to several different thermal cycles. A number of PTH diameters, board constructions and plating thicknesses were evaluated.
Published Code | IPC |
---|---|
Published By | IPC International Inc, formerly Institute for Printed Circuits |
Publication Date | 1988-09-01 |
Pages Count | 90 |
Language | English |
File Size | 5.8 MB |
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