31.020 – Electronic components in general – PDF Standards Store

NZMP 6652:1978

Wed, 06 Nov 2024 05:11:07 +0000

Aims to help both the purchaser and the manufacturer or supplier of electronic equipment to ensure that all the necessary conditions for the successful specification of the full requirements of a system are initially known by both parties, and that at the conclusion of the contract adequate predetermined tests can confirm that these requirements have been met. Covers conditions of use; packaging for transportation and storage; performance; duty, reliability and maintainability; servicing and handbooks; guarantees; and statutory requirements.

JIS C 60721-3-2:2001

Wed, 06 Nov 2024 02:03:46 +0000

Classification of environmental conditions - Part 3: Classification of group of environmental parameters and their severities Section 2: Transportation

Published By	Publication Date	Number of Pages
JIS	2001-11-20	24

JIS C 60695-6-30:2001

Wed, 06 Nov 2024 02:03:40 +0000

Fire hazard testing - Part 6: Guidance and test methods on the assessment of obscuration hazard of vision caused by smoke opacity from electrotechnical products involved in fires - Section 30: Small scale static method - Determination of smoke opacity - Description of the apparatus

Published By	Publication Date	Number of Pages
JIS	2001-11-20	34

JIS C 60695-2-20:2001

Wed, 06 Nov 2024 02:03:36 +0000

Fire hazard testing - Part 2: Glowing/Hot wire-based test methods - Section 20: Hot-wire coil ignitability test on materials

Published By	Publication Date	Number of Pages
JIS	2001-11-20	9

JIS C 60068-2-67:2001

Wed, 06 Nov 2024 02:03:21 +0000

Environmental testing - Part 2: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components

Published By	Publication Date	Number of Pages
JIS	2001-11-20	11

JIS C 60068-2-66:2001

Wed, 06 Nov 2024 02:03:20 +0000

Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapor)

Published By	Publication Date	Number of Pages
JIS	2001-11-20	18

JIS C 60068-2-59:2001

Wed, 06 Nov 2024 02:03:19 +0000

This translation has been made based on the original Japanese Industrial Standard established by the Minister of Economy, Trade and Industry through deliberations at the Japanese Industrial Standards Committee according to the proposal of establishing a Japanese Industrial Standard from the Reliability Center for Electronic Components of Japan (RCJ)/ the Japanese Standards Association (JSA), with a draft of Industrial Standard based on the provision of Clause 1, Article 12 of the Industrial Standardization Law.

JIS C 60068-2-54:2009

Wed, 06 Nov 2024 02:03:18 +0000

This Standard outlines the solder bath wetting balance method applicable for any shape of component terminations to determine the solderability.

It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods.

For surface mounting devices (SMD), IEC 60068-2-69 should be applied.

This Standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.

NOTE: The International Standard corresponding to this Standard and the symbol of degree of correspondence are as follows:

IEC 60068-2-54: 2006 Environmental testing-Part 2-54: Tests-Test Ta: Solderability testing of electronic components by the wetting balance method (MOD)

The symbols which denote the degree of correspondence in the contents between the relevant International Standard and JIS are IDT (identical), MOD (modified) and NEQ (not equivalent) according to ISO/ IEC Guide 21.

JIS C 60050-551:2005

Wed, 06 Nov 2024 02:03:02 +0000

International Electrotechnical Vocabulary - Part 551: Power electronics

Published By	Publication Date	Number of Pages
JIS	2005-12-20	65

JIS C 5602:1986

Wed, 06 Nov 2024 02:02:34 +0000

Glossary of Passive Components for Electronic Equipment

Published By	Publication Date	Number of Pages
JIS	1986-02-01	86