31.190 - Electronic component assemblies
Showing 1–16 of 130 results
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JIS C 60068-2-82:2009
Environmental testing – Part 2-82: Tests-Test XW1: Whisker test methods for electronic and electric components…
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JIS C 60068-2-77:2002
Environmental testing – Part 2-77: Tests – Test 77: Body Strength and Impact shock Published…
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JIS C 60068-2-69:2009
Environmental testing – Part 2-69: Tests-Test Te: Solderability testing of electronic components for surface mounting…
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JIS C 60068-2-69:2019
Environmental testing—Part 2-69: Tests—Test Te/Tc: Solderability testing of electronic components and printed boards by the…
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JIS C 60068-2-21:2009
Environmental testing – Part 2-21: Tests – Test U: Robustness of terminations and integral mounting…
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JIS C 0806-1:1999
Packaging of Components for Automatic Handling – Part 1: Tape Packaging of Components with Axial…
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JIS C 0099:2005
Environmental testing: Tests – Test: Test methods for solderability of surface mounting devices (SMD) by…
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IEC TS 62878-2-4:2015
Substrat avec appareil(s) intégré(s) – Partie 2-4 : directives – Groupes d’éléments d’essai (TEG) Published…
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IEC TS 62878-2-3:2015
Device embedded substrate – Part 2-3: Guidelines – Design guide Published By Publication Date Number…
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IEC TS 62878-2-1:2015
Device embedded substrate – Part 2-1: Guidelines – General description of technology Published By Publication…
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IEC TR 62878-2-8:2021
Device embedding assembly technology – Part 2-8: Guidelines – Warpage control of active device embedded…
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IEC TR 62878-2-7:2019
Device embedding assembly technology – Part 2-7: Guidelines – Accelerated stress testing of passive embedded…
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IEC TR 62878-2-2:2015
Device embedded substrate – Part 2-2: Guidelines – Electrical testing Published By Publication Date Number…
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IEC TR 61191-8:2021
Printed board assemblies – Part 8: Voiding in solder joints of printed board assemblies for…
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IEC TR 61191-7:2020
Printed board assemblies – Part 7: Technical cleanliness of components and printed board assemblies Published…
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IEC TR 61188-8:2021
Circuit boards and circuit board assemblies – Design and use – Part 8: 3D shape…