31.190 - Electronic component assemblies
Showing 97–112 of 130 results
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UNE-EN 62137:2004
Environmental and endurance testing – Test methods for surface-mount boards of area array type packages…
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UNE-EN 62137-4:2014:2015 Edition
Electronics assembly technology – Part 4: Endurance test methods for solder joint of area array…
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UNE-EN 62137-1-5:2009
Surface mounting technology – Environmental and endurance test methods for surface mount solder joints —…
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UNE-EN 62137-3:2012
Electronics assembly technology – Part 3: Selection guidance of environmental and endurance test methods for…
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UNE-EN 62137-1-4:2009
Surface mounting technology – Environmental and endurance test methods for surface mount solder joint —…
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UNE-EN 62137-1-3:2009
Surface mounting technology – Environmental and endurance test methods for surface mount solder joint —…
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UNE-EN 62137-1-1:2007
Surface mounting technology – Environmental and endurance test methods for surface mount solder joint —…
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UNE-EN 62090:2017
Product package labels for electronic components using bar code and two- dimensional symbologies Published By…
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UNE-EN 62090:2003
Product package labels for electronic components using bar code and two- dimensional symbologies Published By…
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UNE-EN 61760-4:2015/A1:2018
Surface mounting technology – Part 4: Classification, packaging, labelling and handling of moisture sensitive devices…
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UNE-EN 61760-4:2015
Surface mounting technology – Part 4: Classification, packaging, labelling and handling of moisture sensitive devices…
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UNE-EN 61193-3:2013
Quality assessment systems – Part 3: Selection and use of sampling plans for printed board…
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UNE-EN 61193-2:2007:2008 Edition
Quality assessment systems — Part 2: Selection and use of sampling plans for inspection of…
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UNE-EN 61193-1:2002
Quality assessment systems — Part 1: Registration and analysis of defects on printed board assemblies…
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UNE-EN 61192-2:2003
Workmanship requirements for soldered electronic assemblies – Part 2: Surface-mount assemblies Published By Publication Date…
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UNE-EN 61192-5:2007
Workmanship requirements for soldered electronic assemblies – Part 5: Rework, modification and repair of soldered…