31.240 – Mechanical structures for electronic equipment – PDF Standards Store ?u= Wed, 06 Nov 2024 02:01:27 +0000 en-US hourly 1 https://wordpress.org/?v=6.7.1 ?u=/wp-content/uploads/2024/11/cropped-icon-150x150.png 31.240 – Mechanical structures for electronic equipment – PDF Standards Store ?u= 32 32 JIS C 5070:2009 ?u=/product/publishers/jis/jis-c-50702009/ Wed, 06 Nov 2024 02:01:27 +0000 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
Published By Publication Date Number of Pages
JIS 2009-12-21 13
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Scope and object

This Standard describes the transportation and storage conditions for surface mounting devices (hereafter referred to as "SMDs") that are fulfilled and used in order to enable trouble-free processing of surface mounting devices, both active and passive.

Conditions for printed boards are not taken into consideration.

The object of this Standard is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability.

Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning" .

NOTE: The International Standard corresponding to this Standard and the symbol of degree of correspondence are as follows:

IEC 61760-2: 2007 Surface mounting technology-Part 2: Transportation and storage conditions of surface mounting devices (SMD )-Application guide (IDT)

The symbols which denote the degree of correspondence in the contents between the relevant International Standard and JIS are IDT (identical), MOD (modified), and NEQ (not equivalent) according to ISO/ IEC Guide 21.

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JIS C 0806-2:2010 ?u=/product/publishers/jis/jis-c-0806-22010/ Wed, 06 Nov 2024 01:57:46 +0000 Packaging of components for automatic handling - Part 2: Packaging of components with unidirectional leads on continuous tapes
Published By Publication Date Number of Pages
JIS 2010-08-20 36
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This Standard applies to the tape packaging of components with two or more unidirectional leads for use in electronic equipment.

In general, the tape is applied to the component leads for this packaging.

This Standard covers requirements for taping techniques used with equipment for automatic handling, preforming of leads, insertion and other operations and includes only those dimensions which are essential to the taping of components intended for the above-mentioned purposes.

NOTE: The International Standard corresponding to this Standard and the symbol of degree of correspondence are as follows:

IEC 60286-2: 2008 Packaging of components for automatic handling Part 2: Packaging of components with unidirectional leads on continuous tapes (IDT)

The symbols which denote the degree of correspondence in the contents between the relevant International Standard and JIS are IDT (identical), MOD (modified), and NEQ (not equivalent) according to ISO/IEC Guide 21-1.

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JIS C 0806-3:2010 ?u=/product/publishers/jis/jis-c-0806-32010/ Wed, 06 Nov 2024 01:57:45 +0000 Packaging of Components for Automatic Handling - Part 3: Packaging of Surface Mount Components on Continuous Tapes
Published By Publication Date Number of Pages
JIS 2010-05-20 27
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This Standard is applicable to the tape packaging of electronic components used for automatic handling without leads or with lead stumps which are intended to be connected to electronic circuits.

NOTE 1 The components with lead stumps mean the generic name of surface mount components with leads as compared with the surface mount components without leads.

NOTE 2 The International Standard corresponding to this Standard and the symbol of degree of correspondence are as follows:

IEC 60286-3 : 2007 Packaging of components for automatic handling—part 3: Packaging of surface mount components on continuous tapes (IDT)

The symbols which denote the degree of correspondence in the contents between the relevant International Standard and JIS are IDT (identical), MOD (modified), and NEQ (not equivalent) according to ISO/IEC GUIDE 21-1.

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IEC TS 62966-3:2021 ?u=/product/publishers/iec/iec-ts-62966-32021/ Tue, 05 Nov 2024 20:14:05 +0000 Mechanical structures for electrical and electronic equipment - Aisle containment for IT cabinets - Part 3: Aspects of operational and personal safety
Published By Publication Date Number of Pages
IEC 2021-01-26 24
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IEC TS 62966-3:2021 defines the requirements for operational and personal safety of aisle containments for IT cabinets.
The aim is to provide physical security for the IT equipment installed in the containment using the criteria “availability” and “safety”.
The requirements apply to all operational, working and maintenance procedures.
This document does not apply to ordinary persons, when using installations and equipment.
The requirements described herein are also intended to ensure that it is possible for authorized personnel to enter and remain in the containment (as accessible equipment) and to maintain or upgrade the systems installed in the containment without risk. It should also be possible to evacuate the containment quickly and safely at any time, especially in the event of a fire or any other hazardous situation, whilst reducing the health risk to personnel to a minimum.
Aspects relating to computing, data processing, data storage, building protection or the data centre itself do not fall within the scope of this document. Only those additional aspects arising from the integration of an aisle containment are considered.
The design and positioning of an aisle containment, which is integrated in the data centre, has influence on the following different aspects of operational safety:
a) escape and evacuation plans;
b) escape routes;
c) emergency exits;
d) functional aspects of escape doors;
e) lighting conditions
f) lighting and signposting of escape routes;
g) fire protection.
In this document, these operational safety requirements and recommendations are considered.
To achieve the highest effectiveness, all these requirements are considered as much as possible during the design of an aisle containment.
This document applies to normal operations, not to the initial installation of the containment.

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IEC TS 62610-2:2011 ?u=/product/publishers/iec/iec-ts-62610-22011/ Tue, 05 Nov 2024 20:12:55 +0000 Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 2: Design guide: Method for determination of forced air-cooling structure
Published By Publication Date Number of Pages
IEC 2011-07-26 38
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IEC/TS 62610-2:2011 provides for compatible methods of forced air cooled cabinets assembled with associated subracks and/or chassis in accordance with IEC 60297 and IEC 60917 series. This design guide contains the following: Thermal interfaces of subrack and/or chassis based equipment in a cabinet; reference temperature; preferred airflow conditions; airflow volume conditions and standard air. Also included are procedures for determining compatible forced airflow conditions in a cabinet by applying typical thermal interface conditions. The drawings used are not intended to indicate product design. They are explanatory indications for determining forced air-cooling structure. The terminology used complies with IEC 60917-1.

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IEC TS 62610-3:2009 ?u=/product/publishers/iec/iec-ts-62610-32009/ Tue, 05 Nov 2024 20:12:55 +0000 Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 3: Design guide: Evaluation method for thermoelectrical cooling systems (Peltier effect)
Published By Publication Date Number of Pages
IEC 2009-12-14 34
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IEC/TS 62610-3:2009(E) provides an evaluation method for thermoelectrical cooling systems (Peltier effect). With this design guide it is possible to calculate the efficiency of the thermoelectrical cooling system (Peltier effect) and its cooling power depending on the ambient temperature and internal temperature. This design guide can also be used to appraise thermoelectrical cooling systems by its efficiency.

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IEC TS 62610-1:2009 ?u=/product/publishers/iec/iec-ts-62610-12009/ Tue, 05 Nov 2024 20:12:53 +0000 Mechanical structures for electronic equipment - Thermal management for cabinets in accordance wit IEC 60297 and IEC 60917 series - Part 1: Design guide: Interface dimension and provision for thermoelectrical cooling systems (Peltier effect)
Published By Publication Date Number of Pages
IEC 2009-09-16 28
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IEC/TS 62610-1:2009(E) provides guidelines for the installation of thermoelectrical cooling systems (Peltier effect) within cabinets ofthe IEC 60297 (19 inch) and IEC 60917 (25 mm) series. The cooling performance is in direct relation with the mounting location within a cabinet. Three typical mounting locations are identified:
1) cabinet with inside or outside mounted thermoelectrical cooling system for the cooling of a whole cabinet;
2) cabinet with top mounted thermoelectrical cooling system for the cooling of a whole cabinet;
3) cabinet with inbuilt thermoelectrical cooling system in form of a subrack for hot spot cooling.

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IEC TS 62454:2007 ?u=/product/publishers/iec/iec-ts-624542007/ Tue, 05 Nov 2024 20:12:07 +0000 Structures mécaniques pour équipements électronique - Guide de conception : Dimensions d'interface et dispositions relatives au refroidissement par l'eau des équipements électroniques dans les armoires des séries IEC 60297 et IEC 60917
Published By Publication Date Number of Pages
IEC 2007-10-10 46
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Structures mécaniques pour équipements électronique - Guide de conception : Dimensions d'interface et dispositions relatives au refroidissement par l'eau des équipements électroniques dans les armoires des séries IEC 60297 et IEC 60917
Published By Publication Date Number of Pages
IEC 2007-10-10 46
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IEC TR 60286-7:2019 ?u=/product/publishers/iec/iec-tr-60286-72019/ Tue, 05 Nov 2024 20:00:24 +0000 Packaging of components for automatic handling - Part 7: Introduction of a bulk blister pack for miniaturized components
Published By Publication Date Number of Pages
IEC 2019-10-14 28
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IEC TR 60286-7:2019 contains information about the introduction of an innovative bulk blister packing system for miniaturized components, for example chip type components of size 1005 (metric) and smaller. It includes a proposal for standardization of the interface between the packaging and automatic assembly systems and requirements to the properties of the packaging.

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IEC TR 60286-3-4:2021 ?u=/product/publishers/iec/iec-tr-60286-3-42021/ Tue, 05 Nov 2024 20:00:23 +0000 Packaging of components for automatic handling - Part 3-4: Packaging of surface mount components on continuous embossed tapes for Auto Loading Feeder
Published By Publication Date Number of Pages
IEC 2021-10-22 30
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IEC TR 60286-3-4:2021(E) considers the proposed requirements for emboss taping for the Auto Loading Feeder mechanism to mount electric components without leads or with stump type leads used for electric circuits. This document is applicable to the embossed carrier tape, with single round sprocket holes, with tape pitches of 2 mm or more (nominal tape width: 8 mm only) among the tapes of Type 2a in IEC 60286-3.

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