{"id":113804,"date":"2024-10-19T02:38:35","date_gmt":"2024-10-19T02:38:35","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/astm-f1259m\/"},"modified":"2024-10-24T22:10:05","modified_gmt":"2024-10-24T22:10:05","slug":"astm-f1259m","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/astm\/astm-f1259m\/","title":{"rendered":"ASTM-F1259M"},"content":{"rendered":"<h3>ASTM F1259M-96<\/h3>\n<h4>Historical Standard: Standard Guide for Design of Flat, Straight-Line Test Structures for Detecting Metallization Open-Circuit or Resistance-Increase Failure Due to Electromigration [Metric]<\/h4>\n<div>\n<h4>ASTM F1259M<\/h4>\n<p><strong>Scope<\/strong><\/p>\n<p>1.1 This guide covers recommended design features for test structures used in accelerated stress tests, as described in Test Method F 1260, to characterize the failure distribution of interconnect metallizations that fail due to electromigration.<\/p>\n<p>1.2 The guide is restricted to structures with a straight test line on a flat surface that are used to detect failures due to an open-circuit or a percent-increase in resistance of the test line.<\/p>\n<p>1.3 This guide is not intended for testing metal lines whose widths are approximately equal to or less than the estimated mean size of the metal grains in the metallization line.<\/p>\n<p>1.4 This guide is not intended for test structures used to detect random defects in a metallization line.<\/p>\n<p>1.5 Metallizations tested and characterized are those that are used in microelectronic circuits and devices.<\/p>\n<p><strong>Keywords<\/strong><\/p>\n<p>design guideline; electromigration; electromigration failure; interconnect metallization; metallization open circuit; metallization resistance; microelectronic; test structure<\/p>\n<p><strong>ICS Code<\/strong><\/p>\n<p>ICS Number Code 17.220.20 (Measurement of electrical and magnetic quantities)<\/p>\n<p><strong>DOI:<\/strong> 10.1520\/F1259M-96<\/p>\n<\/div>\n","protected":false},"excerpt":{"rendered":"<p><b>F1259M-96 Standard Guide for Design of Flat, Straight-Line Test Structures for Detecting Metallization Open-Circuit or Resistance-Increase Failure Due to Electromigration [Metric]<\/b><\/p>\n<table class=\"shortdes-table\" style=\"width: 100%\" border=\"0\" cellspacing=\"0\" cellpadding=\"0\">\n<tbody>\n<tr>\n<td>Published By<\/td>\n<td>Publication Date<\/td>\n<td>Number of Pages<\/td>\n<\/tr>\n<tr>\n<td><a href=\"https:\/\/pdfstandards.shop\/product-category\/publishers\/astm\/\"><b>ASTM<\/b><\/a><\/td>\n<td>1996<\/td>\n<td>2<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":113805,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[285,2637],"product_tag":[],"class_list":{"0":"post-113804","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-17-220-20","7":"product_cat-astm","9":"first","10":"instock","11":"sold-individually","12":"shipping-taxable","13":"purchasable","14":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/113804","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/113805"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=113804"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=113804"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=113804"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}