{"id":233941,"date":"2024-10-19T15:15:27","date_gmt":"2024-10-19T15:15:27","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-iec-62047-312019\/"},"modified":"2024-10-25T09:46:44","modified_gmt":"2024-10-25T09:46:44","slug":"bs-iec-62047-312019","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-iec-62047-312019\/","title":{"rendered":"BS IEC 62047-31:2019"},"content":{"rendered":"

IEC 62047-31:2019 (E) specifies a four-point bending test method for measuring interfacial adhesion energy of the weakest interface in the layered micro-electromechanical systems (MEMS) based on the concept of fracture mechanics. In a variety of MEMS devices, there are many layered material interfaces, and their adhesion energies are critical to the reliability of the MEMS devices. The four-point bending test utilizes a pure bending moment applied to a test piece of layered MEMS device, and the interfacial adhesion energy is measured from the critical bending moment for the steady state cracking in the weakest interface. This test method applies to MEMS devices with thin film layers deposited on semiconductor substrates. The total thickness of the thin film layers should be 100 times less than the thickness of a supporting substrate (typically a silicon wafer piece).<\/p>\n

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
2<\/td>\nundefined <\/td>\n<\/tr>\n
4<\/td>\nCONTENTS <\/td>\n<\/tr>\n
5<\/td>\nFOREWORD <\/td>\n<\/tr>\n
7<\/td>\n1 Scope
2 Normative references
3 Terms, definitions, symbols and designations
3.1 Terms and definitions <\/td>\n<\/tr>\n
8<\/td>\n3.2 Symbols and designations
4 Test piece
4.1 General
4.2 Shape of a test piece
Figure 1 \u2013 Four-point bending test piece
Table 1 \u2013 Symbols and designations of a test piece <\/td>\n<\/tr>\n
9<\/td>\n4.3 Measurement of dimensions
4.4 Evaluation of energy release rate
5 Testing method and test apparatus
5.1 Test principle <\/td>\n<\/tr>\n
10<\/td>\n5.2 Test machine
5.3 Test procedure <\/td>\n<\/tr>\n
11<\/td>\n5.4 Test environment
6 Test report
Figure 2 \u2013 Picture of a four-point bending fixture <\/td>\n<\/tr>\n
12<\/td>\nAnnex A (informative)Failure modes during the four-point bending test
A.1 General
A.2 Some failure modes <\/td>\n<\/tr>\n
13<\/td>\nFigure A.1 \u2013 Several failure modes during the four-point bending test <\/td>\n<\/tr>\n
14<\/td>\nBibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Semiconductor devices. Micro-electromechanical devices – Four-point bending test method for interfacial adhesion energy of layered MEMS materials<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2019<\/td>\n16<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":233946,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[577,2641],"product_tag":[],"class_list":{"0":"post-233941","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-31-080-99","7":"product_cat-bsi","9":"first","10":"instock","11":"sold-individually","12":"shipping-taxable","13":"purchasable","14":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/233941","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/233946"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=233941"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=233941"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=233941"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}