This part of the IEC\/TS 62647 series defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that A DHP electronic systems containing Pb-free solder, piece parts, and PWBs will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certifiability throughout the specified life of performance.<\/p>\n
This specification aims to communicate requirements for a lead-free control plan (LFCP), hereinafter referred to as the Plan, and to assist the Plan owners in the development of their own Plans. The Plan documents the Plan owner\u2019s processes to assure their customers and all other stakeholders that the Plan owner\u2019s products will continue to meet their requirements, given the risks stated in the Introduction.<\/p>\n
This specification does not contain detailed descriptions of the processes to be documented but lists high-level requirements for such processes, and areas of concern to the A DHP industries that need to be addressed by the processes.<\/p>\n
Pb-free risk management should be accomplished through specific requirements added to the Plan owner\u2019s existing infrastructure of product management and control.<\/p>\n
This specification applies to the ADHP electronics system supply chain.<\/p>\n
The control of the Pb-free activities will b e accomplished by the Plan owner addressing the requirements of their Customer. Th ese activities include, but are not limited to, those performed by the s ystem i ntegrator, the original equipment manufacturer (OEM), and their respective supply chains, to the lowest level possible. This should be done with the knowledge that, at the component level, the aerospace industry may not have a great influence over those suppliers. In such cases, the Plan owner assumes responsibility.<\/p>\n
Some applications may have unique requirements that exceed the scope of this specification . The extended scope should be covered separately.<\/p>\n
The requirements of this specification may be tailored to address unique\/specific program needs. If tailoring is performed, the user will obtain documented customer concurrence. Annex A provides a tailoring template that may be used.<\/p>\n
This document may be used by other high-performance and high-reliability industries, at their discretion.<\/p>\n
| PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
|---|---|---|---|---|---|---|---|
| 4<\/td>\n | CONTENTS <\/td>\n<\/tr>\n | ||||||
| 6<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
| 8<\/td>\n | INTRODUCTION <\/td>\n<\/tr>\n | ||||||
| 9<\/td>\n | 1 Scope 2 Normative references <\/td>\n<\/tr>\n | ||||||
| 10<\/td>\n | 3 Terms and definitions <\/td>\n<\/tr>\n | ||||||
| 13<\/td>\n | 4 Symbols and abbreviated terms 5 Objectives 5.1 General <\/td>\n<\/tr>\n | ||||||
| 14<\/td>\n | 5.2 Reliability 5.3 Configuration control and product identification 5.4 COTS assemblies and sub-assemblies 5.5 Deleterious effects of tin whiskers 5.6 Repair, rework, maintenance, and support 6 Technical requirements 6.1 General 6.2 Reliability 6.2.1 General <\/td>\n<\/tr>\n | ||||||
| 15<\/td>\n | 6.2.2 Test and analysis methods 6.2.3 Environmental and operating conditions 6.2.4 Data <\/td>\n<\/tr>\n | ||||||
| 16<\/td>\n | 6.2.5 Conversion of results from available data to applicable conditions 6.3 Configuration control and product identification 6.3.1 General 6.3.2 Termination materials and finishes <\/td>\n<\/tr>\n | ||||||
| 17<\/td>\n | 6.3.3 Solder alloys used in the assembly process 6.3.4 Wiring and connector assemblies 6.3.5 Changes in solder alloys <\/td>\n<\/tr>\n | ||||||
| 18<\/td>\n | 6.3.6 Identification 6.3.7 Part number changes 6.4 COTS assemblies and sub-assemblies 6.4.1 General 6.4.2 COTS assembly and sub-assembly configuration control and product identification 6.5 Deleterious effects of tin whiskers 6.6 Repair, rework, maintenance, and support <\/td>\n<\/tr>\n | ||||||
| 19<\/td>\n | 7 Plan administrative requirements 7.1 Plan organization 7.2 Terms and definitions 7.3 Plan point of contact 7.4 References 7.5 Requirements for suppliers and sub-contractors 7.6 Plan acceptance 7.7 Plan modifications <\/td>\n<\/tr>\n | ||||||
| 20<\/td>\n | Annex A (informative) Template for tailoring requirements of IEC\/TS 62647-1 Table A.1 \u2013 Template for tailoring requirements <\/td>\n<\/tr>\n | ||||||
| 21<\/td>\n | Annex B (informative) Requirements matrix for IEC\/TS 62647-1 Table B.1 \u2013 Requirement matrix <\/td>\n<\/tr>\n | ||||||
| 25<\/td>\n | Annex C (informative) Guidance on configuration control and product identification <\/td>\n<\/tr>\n | ||||||
| 27<\/td>\n | Figure C.1 \u2013 Decision flow chart <\/td>\n<\/tr>\n | ||||||
| 30<\/td>\n | Figure C.2 \u2013 Manufacturing, maintenance and reliability considerations <\/td>\n<\/tr>\n | ||||||
| 31<\/td>\n | Figure C.3 \u2013 Tin whisker considerations <\/td>\n<\/tr>\n | ||||||
| 33<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Process management for avionics. Aerospace and defence electronic systems containing lead-free solder – Preparation for a lead-free control plan<\/b><\/p>\n |