{"id":419681,"date":"2024-10-20T06:27:06","date_gmt":"2024-10-20T06:27:06","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-624152010-2\/"},"modified":"2024-10-26T12:03:12","modified_gmt":"2024-10-26T12:03:12","slug":"bs-en-624152010-2","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-624152010-2\/","title":{"rendered":"BS EN 62415:2010"},"content":{"rendered":"
This standard describes a method for conventional constant current electromigration testing of metal lines, via string and contacts.<\/p>\n
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
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5<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
6<\/td>\n | 1 Scope 2 Symbols, terms and definitions 2.1 Symbols 2.2 Terms and definitions <\/td>\n<\/tr>\n | ||||||
7<\/td>\n | 3 Background 4 Sample size 5 Test structures 5.1 Lines Figures Figure 1 \u2013 TEG of electromigration evaluation for metal line <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | 5.2 Via chains 5.3 Contact chains 6 Test conditions Figure 2 \u2013 TEG of electromigration evaluation for vias <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | 7 Failure criteria 8 Data analysis Figure 3 \u2013 Graph fitted lognormal distribution <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | Figure 4 \u2013 Estimate procedure of current density exponent <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | Figure 5 \u2013 Estimation procedure of activation energy <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Semiconductor devices. Constant current electromigration test<\/b><\/p>\n |