{"id":424454,"date":"2024-10-20T06:51:50","date_gmt":"2024-10-20T06:51:50","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bsi-23-30469486-dc-2023\/"},"modified":"2024-10-26T12:54:08","modified_gmt":"2024-10-26T12:54:08","slug":"bsi-23-30469486-dc-2023","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bsi-23-30469486-dc-2023\/","title":{"rendered":"BSI 23\/30469486 DC 2023"},"content":{"rendered":"
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
---|---|---|---|---|---|---|---|
5<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
7<\/td>\n | 1 Scope 2 Normative references 3 Terms and definitions 4 Attributes of 3D thermal models 4.1 General 4.2 TO-243 <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | 4.3 TO-252 <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | 4.4 TO-263 <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | Annex A (normative) Contribution analysis in case of TO-252 A.1 Attributes of JTAM <\/td>\n<\/tr>\n | ||||||
17<\/td>\n | A.2 Simulation validation <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" BS EN IEC 63378-2. Thermal standardization on semiconductor packages – Part 2. 3D thermal simulation models of discrete semiconductor packages for steady-state analysis<\/b><\/p>\n |