IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials). This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.<\/p>\n
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| 2<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
| 5<\/td>\n | Annex ZA (normative)Normative references to international publicationswith their corresponding European publications <\/td>\n<\/tr>\n | ||||||
| 6<\/td>\n | English CONTENTS <\/td>\n<\/tr>\n | ||||||
| 8<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
| 10<\/td>\n | 1 Scope 2 Normative references 3 Terms and definitions <\/td>\n<\/tr>\n | ||||||
| 11<\/td>\n | 4 Construction and materials 4.1 Construction 4.2 Epoxide woven E-glass underlayer 4.3 Adhesive 4.4 Release film 5 Electrical properties Figure 1 \u2013 Construction of IC carrier tape base materials Tables Table 1 \u2013 Electrical properties <\/td>\n<\/tr>\n | ||||||
| 12<\/td>\n | 6 Non-electrical properties 6.1 Appearance of the IC carrier tape base materials 6.1.1 Delamination 6.1.2 Colloidal particles and metallic particles in underlayer 6.1.3 Colloidal particles in adhesive layer 6.1.4 Scratches of adhesive 6.1.5 Bubbles in underlayer 6.1.6 Breakages and exposures of reinforcement fibre in underlayer 6.2 Dimensional of IC carrier tape base materials 6.2.1 Length and width 6.2.2 Thickness of underlayer 6.2.3 Thickness of adhesive layer 6.3 Splices <\/td>\n<\/tr>\n | ||||||
| 13<\/td>\n | 6.4 Glass transition temperature 6.5 Surface properties of the underlayer side 6.6 Tensile strength and elongation at break 6.7 Water absorption Table 2 \u2013 Glass transition temperature of underlayer Table 3 \u2013 roughness, glossiness(60\u00b0) and surface energy Table 4 \u2013 Tensile strength and elongation at break Table 5 \u2013 Water absorption <\/td>\n<\/tr>\n | ||||||
| 14<\/td>\n | 6.8 Peel strength 6.9 Resin flow 7 Quality assurance 7.1 Quality system 7.2 Responsibility for inspection 7.3 Positions of specimens on the sample Table 6 \u2013 Peel strength Table 7 \u2013 Resin flow <\/td>\n<\/tr>\n | ||||||
| 15<\/td>\n | 7.4 Qualification inspection 7.4.1 General 7.4.2 Samples 7.4.3 Frequency 7.4.4 Criterion rule Table 8 \u2013 Qualification and conformance inspection <\/td>\n<\/tr>\n | ||||||
| 16<\/td>\n | 7.5 Quality conformance inspection 7.5.1 General 7.5.2 Inspection lot 7.5.3 Group A inspection 7.5.4 Group B inspection 7.5.5 Group C inspection 7.5.6 Criterion rule 7.5.7 Rejected lots 7.6 Certificate of conformance 7.7 Safety data sheet <\/td>\n<\/tr>\n | ||||||
| 17<\/td>\n | 8 Packaging, marking and storage 8.1 Packaging, marking 8.2 Storage, storage condition and shelf life <\/td>\n<\/tr>\n | ||||||
| 18<\/td>\n | Annex A (normative)Requirements for the preparation of samples of some performance items Table A.1 \u2013 Requirements for the preparation of samples of some performance items A.1 Ordering information <\/td>\n<\/tr>\n | ||||||
| 19<\/td>\n | Annex B (informative)Engineering information B.1 General B.2 Chemical properties B.3 Electrical properties B.4 Mechanical properties B.5 Physical properties B.6 Thermal properties <\/td>\n<\/tr>\n | ||||||
| 20<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Materials for printed boards and other interconnecting structures – Reinforced base materials, clad and unclad. Base materials for integrated circuit card carrier tape, unclad<\/b><\/p>\n |