{"id":80085,"date":"2024-10-17T18:40:47","date_gmt":"2024-10-17T18:40:47","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/ieee-1386-2001\/"},"modified":"2024-10-24T19:42:24","modified_gmt":"2024-10-24T19:42:24","slug":"ieee-1386-2001","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/ieee\/ieee-1386-2001\/","title":{"rendered":"IEEE 1386 2001"},"content":{"rendered":"
New IEEE Standard – Inactive – Withdrawn. Administratively withdrawn January 2007 The mechanics of a common mezzanine card (CMC) family are defined in this standard.Mezzanine cards, designed to this standard, can be used interchangeably on VME, VME64 andVME64x boards, CompactPCI boards, Multibus I and II boards, desktop computers, portablecomputers, servers, and other similar types of applications. Mezzanine cards can provide modularfront panel I\/O, backplane I\/O or general function expansion or a combination for host computers.Single, wide mezzanine cards are 75 mm wide by 150 mm deep by 8.2 mm high.<\/p>\n
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
---|---|---|---|---|---|---|---|
1<\/td>\n | Title Page <\/td>\n<\/tr>\n | ||||||
3<\/td>\n | Introduction <\/td>\n<\/tr>\n | ||||||
4<\/td>\n | Participants <\/td>\n<\/tr>\n | ||||||
5<\/td>\n | CONTENTS <\/td>\n<\/tr>\n | ||||||
7<\/td>\n | 1. Overview 1.1 Scope 1.2 Purpose 1.3 General arrangement <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | 1.4 Theory and operation of usage <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | 1.5 Parent-child standard 1.6 Conformance <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | 1.7 Dimensions 1.8 Coordinate dimensions 2. References <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | 2.1 Trademarks <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | 2.2 Relationship between VME, VMEbus, VME64, VME64x, and CompactPCI 3. Definitions, abbreviations, and terminology 3.1 Special word usage 3.2 Definitions <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | 3.3 Abbreviations 3.4 Dimensional nomenclature height, width, and depth 4. Mezzanine card mechanics 4.1 CMC size designations and sizes <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | 4.2 EMC envelope 4.3 CMC dimensions <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | 4.4 Voltage keying 4.5 Connector pads and labeling <\/td>\n<\/tr>\n | ||||||
17<\/td>\n | 4.6 CMC connector 4.7 CMC connector assembled on a CMC <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | 4.8 CMC component heights <\/td>\n<\/tr>\n | ||||||
20<\/td>\n | 4.9 CMC connector and standoff heights <\/td>\n<\/tr>\n | ||||||
21<\/td>\n | 4.10 CMC bezel 4.11 CMC test dimensions 4.12 I\/O capability <\/td>\n<\/tr>\n | ||||||
22<\/td>\n | 4.13 Power consumption and dissipation <\/td>\n<\/tr>\n | ||||||
24<\/td>\n | 4.14 Ground connections 4.15 Electromagnetic compatibility 4.16 Shock and vibration 4.17 Environmental <\/td>\n<\/tr>\n | ||||||
25<\/td>\n | 4.18 MTBF 4.19 ESD design 4.20 ESD kit 5. Host CMC slot mechanics <\/td>\n<\/tr>\n | ||||||
26<\/td>\n | 5.1 Stacking height above the host PCB 5.2 Host PCB mechanics <\/td>\n<\/tr>\n | ||||||
28<\/td>\n | 5.3 Connector pads and labeling 5.4 CMC connectors <\/td>\n<\/tr>\n | ||||||
30<\/td>\n | 5.5 CMC connector assembled on a host <\/td>\n<\/tr>\n | ||||||
31<\/td>\n | 5.6 Host board side 1 component height <\/td>\n<\/tr>\n | ||||||
32<\/td>\n | 5.7 Extra shoulder for 13 mm hosts <\/td>\n<\/tr>\n | ||||||
33<\/td>\n | 5.8 Voltage keying pins 5.9 Host front panel or host face plate opening 5.10 Filler panels <\/td>\n<\/tr>\n | ||||||
36<\/td>\n | 5.11 Host test dimensions <\/td>\n<\/tr>\n | ||||||
38<\/td>\n | 5.12 I\/O capability 5.13 Power dissipation 5.14 Grounding connections 5.15 Electromagnetic compatibility <\/td>\n<\/tr>\n | ||||||
39<\/td>\n | 5.16 Environmental 6. Electrical and logical layers 6.1 Connector utilization 6.2 CMC connector pin assignments 6.3 Rear I\/O mapping <\/td>\n<\/tr>\n | ||||||
41<\/td>\n | 6.4 BUSMODE signals <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" IEEE Standard for a Common Mezzanine Card Family: CMC<\/b><\/p>\n |