BS EN 60249-1:1993:1983 Edition

$198.66

Base materials for printed circuits – Base materials for printed circuits. Test methods

Published By	Publication Date	Number of Pages
BSI	1983	70

Guaranteed Safe Checkout

Category: BSI

If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. We’re here to assist you 24/7.
Email:[email protected]

Description

Describes methods of testing the electrical, mechanical and other properties of base materials in sheet or roll form irrespective of the nature of the insulating base material.

Additional information

Status	Withdrawn
Pages	70
Publication Date	1983-07-29
Withdrawn Date	2006-10-01
ISBN	0 580 13343 5
Standard Number	BS EN 60249-1:1993, IEC 60249-1:1982
Title	Base materials for printed circuits – Base materials for printed circuits. Test methods
Identical National Standard Of	EN 60249-1:1993, IEC 60249-1:1982
Descriptors	Films (states of matter), Density measurement, Visual inspection (testing), Blistering, Adhesion tests, Coated materials, Test equipment, Metal coatings, Dimensional measurement, Dimensional changes, Specimen preparation, Electronic equipment and components, Corrosion tests, Surface defects, Flammability, Bend testing, Flatness measurement, Test specimens, Damp-heat tests, Laminates, Fatigue testing, Resistance measurement, Fire tests, Printed-circuit bases, Electrical testing, Sample location, Peeling tests, Weight measurement, Foil, Sheet materials, Dimensions, Copper, Dielectric-strength tests, Mechanical testing, Thickness measurement, Printed circuits, Printed-circuit boards, Humidity, Permittivity measurement, Thermal testing, Dissipation factor, Thermal-shock tests, Strength of materials, Tracking tests, High-temperature testing, Environmental testing, Solderability testing
Publisher	BSI
Committee	EPL/501
ICS Codes	31.180 - Printed circuits and boards

Preview PDF


PDF Format	Searchable	Printable	Preview Now

BS EN 60249-1:1993:1983 Edition

Related products