BS EN 60749-25:2003

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Semiconductor devices. Mechanical and climatic test methods – Temperature cycling

Published By	Publication Date	Number of Pages
BSI	2003	16

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Categories: 31.080.01 - Semiconductor devices in general, BSI

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Description

Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.

Additional information

Status	Definitive
Pages	16
Publication Date	2003-10-30
ISBN	0 580 42859 1
Partially Replaces	BS EN 60749:1999
Standard Number	BS EN 60749-25:2003
Title	Semiconductor devices. Mechanical and climatic test methods – Temperature cycling
Identical National Standard Of	IEC 60749-25:2003, EN 60749-25:2003, EN 60068-2-30:1999
Descriptors	Thermal testing, Solders, Electronic equipment and components, Integrated circuits, Environmental testing, Climate, Testing conditions, Thermal-cycling tests, Semiconductor devices, Heating tests, Mechanical testing
Publisher	BSI
Committee	EPL/47
ICS Codes	31.080.01 - Semiconductor devices in general

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BS EN 60749-25:2003

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