BS EN 61188-5-2:2003

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Printed boards and assemblies. Design and use. Attachment (land/joint) considerations – Discrete components

Published By	Publication Date	Number of Pages
BSI	2003	56

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Description

Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.

Additional information

Status	Definitive
Pages	56
Publication Date	2003-10-16
ISBN	0 580 42760 9
Standard Number	BS EN 61188-5-2:2003
Title	Printed boards and assemblies. Design and use. Attachment (land/joint) considerations – Discrete components
Identical National Standard Of	IEC 61188-5-2:2003, EN 61188-5-2 (IEC 61188-5-2:2003) AS
Descriptors	Design, Printed-circuit boards, Printed circuits, Electronic equipment and components
Publisher	BSI
Committee	EPL/501
ICS Codes	31.190 - Electronic component assemblies

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BS EN 61188-5-2:2003

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