BS EN 61188-5-8:2008

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Printed boards and printed board assemblies. Design and use – Attachments (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA)

Published By	Publication Date	Number of Pages
BSI	2008	34

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Description

IEC 61188-5-8:2007 provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder joint, and also allow for inspection, testing and reworking of those solder joints. This publication is to be read in conjunction with /2.

Additional information

Status	Definitive
Pages	34
Publication Date	2008-05-30
ISBN	978 0 580 59958 3
Standard Number	BS EN 61188-5-8:2008
Title	Printed boards and printed board assemblies. Design and use – Attachments (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA)
Identical National Standard Of	IEC 61188-5-8:2007, EN 61188-5-8:2008
Descriptors	Shape, Surface mounting devices, Patterns, Soldering, Design, Soldered joints, Printed-circuit boards, Printed circuits, Dimensional tolerances, Electronic equipment and components, Dimensions
Publisher	BSI
Committee	EPL/501
ICS Codes	31.180 - Printed circuits and boards

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BS EN 61188-5-8:2008

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