BS EN 62047-2:2006

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Semiconductor devices. Micro-electromechanical devices – Tensile testing method of thin film materials

Published By	Publication Date	Number of Pages
BSI	2006	16

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Categories: 31.080.99 - Other semiconductor devices, BSI

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Description

Specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices. The main structural materials for MEMS, micromachines and similar devices have special features such as typical dimensions in the order of a few microns, a material fabrication by deposition, and a test piece fabrication by non-mechanical machining using etching and photolithography. This International Standard specifies the testing method, which enables a guarantee of accuracy corresponding to the special features.

Additional information

Status	Definitive
Pages	16
Publication Date	2006-11-30
ISBN	0 580 49740 2
Standard Number	BS EN 62047-2:2006
Title	Semiconductor devices. Micro-electromechanical devices – Tensile testing method of thin film materials
Identical National Standard Of	EN 60317-0-5:1994/A2:2000, EN 62047-2:2006, IEC 62047-2:2006
Descriptors	Integrated circuits, Thin films, Test equipment, Tensile testing, Electronic equipment and components, Electromechanical devices, Semiconductor technology, Semiconductor devices, Test specimens
Publisher	BSI
Committee	EPL/47
ICS Codes	31.080.99 - Other semiconductor devices

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BS EN 62047-2:2006

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