🔥🔥 Don’t Miss Out on Our End of Autumn Sale. If you have any questions, feel free to click the bottom right corner to contact our customer service..

Concat us[email protected]
Shopping Cart

No products in the cart.

🔍
ASHRAE Book PowerTrends 2ed 2012

ASHRAE Book PowerTrends 2ed 2012

$31.96

ASHRAE Datacom Equipment Power Trends and Cooling Applications, 2nd Edition

Published By Publication Date Number of Pages
ASHRAE 2012 148
PDF Format Searchable Printable Preview Now
Guaranteed Safe Checkout
Category:

If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. We’re here to assist you 24/7.
Email:[email protected]

The Book Datacom Facility Designers Need Now to Be Ready for the Future Datacom equipment technology is advancing at a rapid pace, resulting in relatively short product cycles and an increased frequency of datacom equipment upgrades. Because datacom facilities and their associated HVAC infrastructure are typically built to have longer life cycles, any modern datacom facility needs the ability to seamlessly accommodate the multiple datacom equipment deployments it will experience during its lifetime. Based on the latest information from leading datacom equipment manufacturers, this second edition of Datacom Equipment Power Trends and Cooling Applications provides new and expanded datacom equipment power trend charts through 2020 to allow datacom facility designers to more accurately predict the equipment loads their facilities will need to accommodate in the future and supplies ways of applying the trend information to datacom facility designs today. This edition also enhances the server power trends by including trends for the number of sockets and includes a new chapter with practical information on how to apply the trends in a data center environment. Also included is an overview of various air- and liquid-cooling system options for handling future loads and an invaluable appendix containing terms and definitions used by datacom equipment manufacturers, the facilities operation industry, and the cooling design and construction industry. This book is the second in the ASHRAE Datacom Series, authored by ASHRAE Technical Committee 9.9, Mission Critical Facilities, Technology Spaces and Electronic Equipment. This series provides comprehensive treatment of datacom cooling and related subjects. Keywords: power trend, cooling, air cooling, liquid cooling, datacom, data center

PDF Catalog

PDF Pages PDF Title
1 Datacom Equipment Power Trends and Cooling Applications, Second Edition
6 Contents
8 Foreword
10 Preface
12 Acknowledgments
14 Chapter 1—Introduction

1.1 Purpose/Objective
16 Chapter 2—Background

2.1 Datacom Facility Planning
17 Table 2.1 Datacom Computer Room Area Breakdown Example
18 Figure 2.1 Datacom computer room area allocation example.
19 2.2 Simple Example of Datacom Equipment Growth Impact on a Facility
21 Table 2.2 5000 ft² (465 m²) Datacom Equipment Room Breakdown—Current Chilled-Water Cooling Load
22 Table 2.3 5000 ft² (465 m²) Datacom Equipment Room Breakdown— Anticipated Chilled-Water Cooling Load
23 Figure 2.2 Power density comparisons for two scenarios of data center growth.
24 2.3 Overview of Power Density Definitions
25 2.4 IT and Facility Industry Collaboration
26 2.5 IT Industry Background
28 Chapter 3—Component Power Trends

3.1 Introduction
3.2 Servers and Their Components
29 Figure 3.1 Processor.
Figure 3.2 1U server processor heat sink.
Figure 3.3 Typical dual in-line memory module (DIMM) with and without a heat spreader.
30 Figure 3.4 Typical dual-socket motherboard.
31 Figure 3.5 Typical compute server rack and packaging.
32 Figure 3.6 Example blade.
Figure 3.7 Example blade server chassis.
33 Figure 3.8 ASHRAE definitions for rack airflow.
3.3 Server Power Distribution
Figure 3.9 Example of power consumption within a server.
34 3.4 Component Power Trends
35 Figure 3.10 Individual processor power trend.
37 Figure 3.11 Server memory power trend.
38 Figure 3.12 Large number of smaller cores in an MIC processor.
39 Figure 3.13 GPU with associated advanced thermal solution.
40 Figure 3.14 Typical HDD subcomponent view.
42 Figure 3.15 Enterprise HDD (LFF 7200 rpm) operating power and power efficiency trend.
Figure 3.16 Enterprise HDD (SFF 10K rpm) operating power and power efficiency trend.
43 Figure 3.17 Peripheral component interconnect (PCI) express solid-state storage card.
44 3.5 Power Supplies
45 Figure 3.18 Enterprise NVM storage power planning guide.
46 Figure 3.19 Example power supply efficiencies.
Figure 3.20 Power supply efficiency improvement example.
48 Chapter 4—Load Trends and Their Applications

4.1 Introduction—ASHRAE Updated and Expanded Air-Cooling Power Trends
50 4.2 Definition of Watts per Equipment Square Foot Metric
4.3 The 2005 ASHRAE POWER Trend Chart
51 Figure 4.1 Graphical representation of width × depth measurements used for equipment area definitions.
Figure 4.2 The 2005 ASHRAE power trend chart.
52 4.4 POWER Trend Chart Evolution
4.5 Volume Servers
53 Figure 4.3 2005 ASHRAE power trend chart for compute servers.
54 Figure 4.4 1U servers—2005 and 2012 trends.
Figure 4.5 2U servers—2005 and 2012 trends.
55 Figure 4.6 4U servers—2005 and 2012 trends.
4.6 Idle Power For Servers
56 Figure 4.7 Blade servers (7U, 9U, and 10U)—2005 and 2012 trends.
57 Table 4.1 Volume Server Power Trends
58 Table 4.2 Power Trends of Nonstandard-Planform Equipment
Figure 4.8 SpecPower trend in idle power.
59 Table 4.3 Idle Power Technologies
60 Figure 4.9 PSU efficiency trends.
4.7 ASHRAE Liquid-Cooling Power Trends
61 Figure 4.10 Liquid-cooled rack power trends.
4.8 Product Cycle vs. Building Life Cycle
62 4.9 Predicting Future Loads
4.10 Provisioning For Future Loads
64 Chapter 5—Air Cooling of Computer Equipment

5.1 Introduction
65 5.2 Air Cooling Overview
Figure 5.1 Hot aisle/cold aisle cooling principle.
5.3 Underfloor Distribution
66 Figure 5.2 Raised-floor implementation most commonly found in data centers using CRAC units.
5.4 Overhead Distribution
67 Figure 5.3 Raised-floor implementation using building air from a central plant.
Figure 5.4 Raised-floor implementation using two-story configuration with CRAC units on the lower floor.
68 Figure 5.5 Overhead cooling distribution commonly found in central office environments.
5.5 Managing Supply and Return Airflows
69 Figure 5.6 Raised-floor implementation using a dropped ceiling as a hot air return plenum.
Figure 5.7 Raised-floor implementation using panels to limit hot aisle/ cold aisle “mixing” by containing the cold aisle supply.
Figure 5.8 Raised-floor implementation using panels to limit hot aisle/ cold aisle “mixing” by containing the hot aisle exhaust.
70 Figure 5.9 Raised-floor implementation using inlet and outlet plenums/ ducts integral to the rack.
Figure 5.10 Raised-floor implementation using outlet plenums/ducts integral to the rack
71 5.6 Local Distribution
72 Figure 5.11 Local cooling distribution using overhead cooling units mounted to the ceiling.
Figure 5.12 Local cooling distribution using overhead cooling units mounted to the ceiling of the hot aisle.
Figure 5.13 Local cooling distribution using overhead cooling units mounted to the tops of racks.
73 Figure 5.14 Local cooling via integral rack cooling units on the exhaust side of the rack.
Figure 5.15 Local cooling via integral rack cooling units on the inlet side of the rack.
Figure 5.16 Local cooling units interspersed within a row of racks.
74 5.7 Air-Cooling Equipment
5.8 Air-Cooling Controls
76 5.9 Reliability
78 Chapter 6—Liquid Cooling of Computer Equipment

6.1 Introduction
79 6.2 Liquid Cooling Overview
6.3 Liquid-Cooled Computer Equipment
80 Figure 6.1 Internal liquid-cooling loop exchanging heat with liquid-cooling loop external to racks.
Figure 6.2 Internal liquid-cooling loop extended to liquid-cooled external modular cooling unit.
81 Figure 6.3 Internal liquid-cooling loop restricted within rack.
6.4 Liquid Coolants for Computer Equipment
83 6.5 Datacom Facility Chilled-Water System
84 Figure 6.4 Typical example of chilled-water loop and valve architecture.
85 6.6 Reliability
86 Chapter 7—Practical Example of Trends to Data Center Design

7.1 Introduction
88 Table 7.1 Document Trend Chart Loads—Today and Future Refreshes— Watts per Chassis and Watts per Cabinet/Rack
90 Table 7.2 Today and Future Refreshes—Server Types per Zone—Watts per Chassis and Watts per Cabinet/Rack
91 Table 7.3 Establishing Current ITE Loads
Table 7.4 Establishing the Adjustment Factor to be Applied to Trend Chart Loads
92 Table 7.5 Today and Future Refreshes—Server Types per Zone—Adjusted Watts per Cabinet/Rack
96 Appendix A—Glossary
114 Appendix B—Additional Power Trend Chart Information/Data

Figure B.1 1U Servers—2005 and 2012 trends (SI units).
115 Figure B.2 2U Servers—2005 and 2012 trends (SI units).
Figure B.3 4U Servers—2005 and 2012 trends (SI units).
116 Figure B.4 Blade servers (7U, 9U, and 10U)—2005 and 2012 trends (SI units).
117 Figure B.5 1U Servers—2005 and 2012 trends (non-log scale, I-P units).
118 Figure B.6 2U Servers—2005 and 2012 trends (non-log scale, I-P units).
119 Figure B.7 4U Servers—2005 and 2012 trends (non-log scale, I-P units).
120 Figure B.8 Blade servers (7U, 9U, and 10U)—2005 and 2012 trends (non- log scale, I-P units).
121 Figure B.9 1U Servers—2005 and 2012 trends (non-log scale, SI units).
122 Figure B.10 2U Servers—2005 and 2012 trends (non-log scale, SI units).
123 Figure B.11 4U Servers—2005 and 2012 trends (non-log scale, SI units).
124 Figure B.12 Blade servers (7U, 9U, and 10U)—2005 and 2012 trends (non- log scale, SI units).
126 Appendix C—Electronics, Semiconductors, Microprocessors, ITRS

C.1 Cost-Performance Processors
127 Figure C.1 Cost-performance die size.
Figure C.2 Cost-performance power density.
128 Figure C.3 Cost-performance maximum power.
129 Figure C.4 Cost-performance junction temperatures.
Figure C.5 Cost-performance thermal resistance.
130 C.2 High-Performance Processors
Figure C.6 High-performance die size.
131 Figure C.7 High-performance power density.
132 Figure C.8 High-performance maximum power.
C.3 Post CMOS
133 Figure C.9 High-performance junction temperature.
Figure C.10 High-performance thermal resistance.
135 Table C.1 Post-CMOS Research Activities
136 References
137 Bibliography
138 Index
ASHRAE Book PowerTrends 2ed 2012
$31.96