ASHRAE ThermalGuidelinesforDataProcessingEnvironments 3rdEdition 2012
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ASHRAE Thermal Guidelines for Data Processing Environments, 3rd Edition
| Published By | Publication Date | Number of Pages |
| ASHRAE | 2012 | 152 |
There is often a mismatch of IT equipment environmental requirements with adjacent equipment requirements or with facility operating conditions and therefore a strong need to find common solutions and standard practices that facilitate IT equipment interchangeability while preserving industry innovation. Thermal Guidelines for Data Processing Environments provides a framework for improved alignment between IT equipment hardware manufacturers (including manufacturers of computers, servers, and storage products), data center designers, and facility operators and managers. This guide covers five primary areas: equipment operating environment guidelines for air-cooled equipment (six classes are defined), environmental guidelines for liquid-cooled equipment (five classes are defined), facility temperature and humidity measurement (to evaluate data center health), equipment placement and airflow patterns (a hot-aisle/cold-aisle layout is recommended), and equipment manufacturers’ heat load and airflow requirements reporting. In reaction to the industry trend of increased energy efficiency for data center operation, this third edition of Thermal Guidelines for Data Processing Environments provides groundbreaking, vendor-neutral information that will empower data center designers, operators, and managers to better determine the impact of varying design and operation parameters. This book is the first in the ASHRAE Datacom Series, authored by ASHRAE Technical Committee 9.9, Mission Critical Facilities, Technology Spaces and Electronic Equipment. This series provides comprehensive treatment of datacom cooling and related subjects. Keywords: datacom, data center, data processing, thermal guidelines
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 1 | Thermal Guidelines for Data Processing Environments, Third Edition |
| 6 | Contents |
| 10 | Preface to the Third Edition |
| 12 | Acknowledgments |
| 14 | Chapter 1—Introduction |
| 15 | Figure 1.1 Heat density trends, projections for information technology products (ASHRAE 2005a). Figure 1.2 1U server trends showing 2005 and new 2011 projections (ASHRAE 2012). |
| 16 | 1.1 Document Flow |
| 17 | 1.2 Primary Users of This Document |
| 18 | 1.3 Compliance 1.4 Definitions and terms |
| 22 | Chapter 2—Environmental Guidelines for Air-Cooled Equipment 2.1 Background |
| 23 | Figure 2.1 Server metrics for determining data center operating environment envelope. 2.2 New Air-Cooled Equipment Environmental Specifications |
| 26 | Table 2.1 Comparison of 2004 and 2008 Versions of Recommended Envelopes Table 2.2 2008 and 2011 Thermal Guideline Comparisons |
| 27 | Table 2.3 2011 Thermal Guidelines—SI Version (I-P Version in Appendix B) |
| 30 | Table 2.4 NEBS Environmental Specifications |
| 31 | Table 2.5 ETSI Class 3.1 and 3.1e Environmental Requirements Figure 2.2 Climatogram of the ETSI Class 3.1 and 3.1e environmental conditions (ETSI 2009). |
| 32 | Figure 2.3 Environmental classes for data centers—SI Version (see Table 2.3 for dry-bulb temperature derating for altitude). Figure 2.4 Environmental Classes for Data Centers—I-P Version (see Table 2.3 for dry-bulb temperature derating for altitude). |
| 34 | Figure 2.5 World population distribution versus altitude (Cohen and Small 1998). |
| 35 | 2.3 Guide for the Use and Application of the ASHRAE Data Center Classes |
| 36 | Table 2.6 Range of Options to Consider for Optimizing Energy Savings |
| 37 | 2.4 Server Metrics to Guide Use of New Guidelines 2.4.1 Server Power Trend versus Ambient Temperature |
| 38 | Figure 2.6 Server power increase (Class A3 is an estimate) versus ambient temperature for Classes A2 and A3. |
| 39 | Figure 2.7 Server flow rate increase versus ambient temperature increase. 2.4.2 Acoustical Noise Levels in Data Center versus Ambient Temperature |
| 40 | Table 2.7 Expected Increase in A-Weighted Sound Power Level (in decibels) |
| 42 | 2.4.3 Server Reliability Trend versus Ambient Temperature |
| 44 | Table 2.8 Relative ITE Failure Rate x-Factor as a Function of Constant ITE Air Inlet Temperature |
| 45 | Figure 2.8 Time-weighted x-factor estimates for air-side economizer for selected U.S. cities. 2.4.4 Server Reliability versus Moisture, Contamination, and other Temperature Effects |
| 48 | 2.4.5 Server Performance Trend versus Ambient Temperature 2.4.6 Server Cost Trend versus Ambient Temperature |
| 49 | 2.4.7 Summary of New Air-Cooled Equipment Environmental Specifications |
| 52 | Chapter 3—Environmental Guidelines for Liquid-Cooled Equipment 3.1 ITE Liquid Cooling |
| 55 | Figure 3.1 Liquid-cooled rack or cabinet with external CDU. Figure 3.2 Combination air- and liquid-cooled rack or cabinet with internal CDU. |
| 56 | Figure 3.3 Liquid-cooling systems/loops for a data center. 3.2 Facility Water Supply Characteristics for ITE 3.2.1 Facility Water Supply Temperature Classes for ITE 3.2.1.1 Liquid-Cooling Environmental Class Definitions |
| 57 | Table 3.1 2011 ASHRAE Liquid-Cooled Guidelines |
| 58 | Figure 3.4 Class W1/W2/W3 liquid-cooling classes typical infrastructure. Figure 3.5 Class W4 liquid-cooling class typical infrastructure. Figure 3.6 Class W5 liquid-cooling class typical infrastructure. 3.2.2 Condensation Considerations |
| 59 | 3.2.3 Operational Characteristics |
| 60 | Figure 3.7 Typical water flow rates for constant heat load. 3.2.4 Water Flow Rates/Pressures 3.2.5 Velocity Limits 3.2.6 Water Quality |
| 61 | Table 3.2 Maximum Velocity Requirements Table 3.3 Water Quality Specifications Supplied to ITE 3.3 Liquid-Cooling Deployments in NEBS-Compliant Spaces |
| 62 | Figure 3.8 Liquid cooling systems/loops for a NEBS space. 3.3.1 NEBS Space Similarities and Differences |
| 63 | 3.3.2 Use of CDU in NEBS Spaces 3.3.3 Refrigerant Distribution Infrastructure 3.3.4 Connections |
| 64 | 3.3.5 Condensation Consideration 3.3.6 Close-Coupled Cooling Units |
| 66 | Chapter 4—Facility Temperature and Humidity Measurement 4.1 Facility Health and Audit Tests |
| 67 | Figure 4.1 Measurement points in aisle. 4.1.1 Aisle Measurement Locations |
| 68 | Figure 4.2 Measurement points between rows. Figure 4.3 Measurement points in a hot-aisle/cold-aisle configuration. |
| 69 | 4.1.2 HVAC Operational Status 4.1.3 Evaluation 4.1.3.1 Aisle Temperature and Humidity Levels 4.1.3.2 HVAC Unit Operation 4.2 Equipment Installation Verification Tests |
| 70 | Figure 4.4 Monitor points for configured racks. 4.3 Equipment Troubleshooting Tests |
| 71 | Figure 4.5 Monitor points for 1U to 3U equipment. Figure 4.6 Monitor points for 4U to 6U equipment. |
| 72 | Figure 4.7 Monitor points for 7U and larger equipment. Figure 4.8 Monitor points for equipment with localized cooling. |
| 74 | Chapter 5— Equipment Placement and Airflow Patterns 5.1 Equipment Airflow 5.1.1 Airflow Protocol Syntax 5.1.2 Airflow Protocol for Equipment |
| 75 | Figure 5.1 Syntax of face definitions. Figure 5.2 Recommended airflow protocol. |
| 76 | Figure 5.3 View of a hot-aisle/cold-aisle configuration. 5.1.3 Cabinet Design 5.2 Equipment Room Airflow 5.2.1 Placement of Cabinets and Rows of Cabinets |
| 77 | Figure 5.4 View of a hot-aisle/cold-aisle configuration. Figure 5.5 Example of hot and cold aisles for nonraised floor. 5.2.2 Cabinets with Dissimilar Airflow Patterns |
| 78 | Figure 5.6 Seven-tile aisle pitch, equipment aligned on cold aisle. 5.2.3 Aisle Pitch |
| 79 | Table 5.1 Aisle Pitch Allocation Figure 5.7 Seven-tile aisle pitch, equipment aligned on hot aisle. |
| 82 | Chapter 6—Equipment Manufacturers’ Heat and Airflow Reporting 6.1 Providing Heat Release and Airflow Values |
| 83 | 6.2 Equipment Thermal Report |
| 84 | 6.3 EPA Energy Star Reporting |
| 85 | Table 6.1 Example Thermal Report (Continued) |
| 87 | 6.3.1 Server Thermal Data Reporting Capabilities |
| 88 | Appendix A—2008 ASHRAE Environmental Guidelines for Datacom Equipment—Expanding the Recommended Environmental Envelope Table A.1 Comparison of 2004 and 2008 Versions of Recommended Envelopes |
| 90 | Figure A.1 2008 recommended environmental envelope (new Class 1 and 2). |
| 92 | Figure A.2 Inlet and component temperatures with fixed fan speed. Figure A.3 Inlet and component temperatures with variable fan speed. |
| 98 | Appendix B—2011 Air-Cooled Equipment Thermal Guidelines (I-P) |
| 99 | Table B.1 2011 Thermal Guidelines—IP Version (SI Version in Table 2.3) |
| 102 | Appendix C—Detailed Flowchart for the Use and Application of the ASHRAE Data Center Classes |
| 103 | Figure C.1 Guidance for applying thermal guidelines. |
| 104 | Figure C.2 Guidance for applying thermal guidelines. |
| 105 | Figure C.3 Guidance for applying thermal guidelines to major retrofit projects. |
| 106 | Figure C.4 Guidance for applying thermal guidelines to existing facilities looking for efficiency gains. |
| 108 | Appendix D—Static Control Measures |
| 110 | Figure D.1 Typical test setup to measure floor conductivity. |
| 112 | Appendix E—OSHA and Personnel Working in High Air Temperatures |
| 113 | Table E.1 Permissible Heat Exposure Threshold Limit Value (ACGIH 1992) |
| 116 | Appendix F—Psychrometric Charts |
| 117 | Figure F.1 Allowable Class A1–A4, B, and C operating conditions (SI units). Figure F.2 Allowable Class A1–A4, B, and C operating conditions (I-P units). |
| 118 | Figure F.3 Allowable data center and NEBS operating conditions (SI units). Figure F.4 Allowable data center and NEBS operating conditions (I-P units). |
| 119 | Figure F.5 Recommended data center and central office operating conditions (SI units). Figure F.6 Recommended data center and central office operating conditions (I-P units). |
| 120 | Appendix G—Altitude Derating Curves |
| 121 | Figure G.1 Class A1 to A4 temperature vs. altitude. Figure G.2 Classes A1 and A2 and NEBS temperature vs. altitude. (*Shown NEBS temperature derating for increased altitude is for reference only; actual derating is equipment-supplier dependent.) |
| 122 | Appendix H—Practical Example of the Impact of Compressorless Cooling on Hardware Failure Rates |
| 123 | Figure H.1 Histogram of dry-bulb temperatures for Chicago. Figure H.2 Dry-bulb temperatures for Chicago with economization assumptions that include reuse of ITE exhaust heat to maintain a minimum 15°C to 20°C (59°F to 68°F) temperature and a 1.5°C (2.7°F) temperature rise from outdoor air to server inlet. |
| 124 | Table H.1 Time-at-Temperature Weighted Failure Rate Calculation for ITE in Chicago |
| 126 | Appendix I—IT Equipment Reliability Data for Selected Major U.S. and Global Cities |
| 129 | Figure I.1 Failure rate projections for air-side economizer for selected U.S. cities. Figure I.2 Failure rate projections for water-side economizer for selected U.S. cities. |
| 130 | Table I.1 Time-Weighted Failure Rate x-Factor Calculations for Class A2 for Air-Side Economization for Selected Major U.S. Cities Assuming a 1.5°C (2.7°F) Temperature Rise between Outdoor Ambient Temperature and the ITE Inlet Air Temperature |
| 131 | Table I.2 Time-Weighted Failure Rate x-Factor Calculations for Class A2 for Water-Side Economization for Selected Major U.S. Cities Assuming a 9°C (16.2°F) Temperature Rise between Outdoor Ambient Temperature and the ITE Inlet Air Temperature |
| 132 | Figure I.3 Failure rate projections for water-side economizer with a dry- cooler-type tower for selected U.S. cities. Figure I.4 Failure rate projections for air-side economizer for selected global cities. |
| 133 | Table I.3 Time-Weighted Failure Rate x-Factor Calculations for Class A2 for Water-Side Dry-Cooler-Type Tower Economization for Selected Major U.S. Cities Assuming a 12°C (21.6°F) Temperature Rise between Outdoor Ambient Temperature and the ITE Inle… |
| 134 | Table I.4 Time-Weighted Failure Rate x-Factor Calculations for Class A2 for Air-Side Economization for Selected Major Global Cities Assuming a 1.5°C (2.7°F) Temperature Rise between Outdoor Ambient Temperature and the ITE Inlet Air Temperature |
| 135 | Figure I.5 Failure rate projections for water-side economizer for selected global cities. Figure I.6 Failure rate projections for water-side economizer with a dry- cooler-type tower for selected global cities. |
| 136 | Table I.5 Time-Weighted Failure Rate x-Factor Calculations for Class A2 for Water-Side Economization for Selected Major U.S. Cities Assuming an 9°C (16.2°F) Temperature Rise between Outdoor Ambient Temperature and the ITE Inlet Air Temperature |
| 137 | Table I.6 Time-Weighted Failure Rate x-Factor Calculations for Class A2 for Water-Side Dry-Cooler Type Tower Economization for Selected Major U.S. Cities Assuming a 12°C (21.6°F) Temperature Rise between Outdoor Ambient Temperature and the ITE Inle… |
| 138 | Figure I.7 Number of hours per year of chiller operation required for air- side economizer for selected U.S. cities. Figure I.8 Number of hours per year of chiller operation required for water-side economizer for selected U.S.cities. |
| 139 | Figure I.9 Number of hours per year of chiller operation required for water-side dry-cooler economizer for selected U.S.cities. Figure I.10 Number of hours per year of chiller operation required for air- side economizer for selected global cities. |
| 140 | Figure I.11 Number of hours per year of chiller operation required for water-side economizer for selected global cities. Figure I.12 Number of hours per year of chiller operation required for water-side dry-cooler economizer for selected global cities. |
| 142 | Appendix J Most Common Problems in Water-Cooled Systems |
| 146 | References and Bibliography |
