BS EN 60749-19:2003+A1:2010

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Semiconductor devices. Mechanical and climatic test methods – Die shear strength

Published By	Publication Date	Number of Pages
BSI	2010	10

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Categories: 31.080.01 - Semiconductor devices in general, BSI

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Description

This part of IEC 60749 determines (see note) the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates (for the purpose of this test method, the term “semiconductor die” should be taken to include passive elements).

This test method is generally only applicable to cavity packages or as a process monitor. It is not applicable for die areas greater than 10 mm². It is also not applicable to flip chip technology or to flexible substrates.

NOTE 1 This determination is based on a measure of the force applied to the die or to the element, and, if a failure occurs, the type of failure resulting from the application of force and the visual appearance of the residual die attach medium and the header/substrate metallization.

NOTE 2 In cavity packages, die shear strength is measured in order to assure the strength of the die attachment within the cavity.

In non-cavity packages, such as plastic encapsulated packages, die bonding is used to prevent die movement until the resin mould is completely cured. Normally, specification of the die shear strength and the minimum adhesion area of die bond after moulding are unnecessary, except in the following circumstances:

when the die needs to be electrically connected to die pad;
when heat from the die needs to be diffused through the die bond.

Additional information

Status	Definitive
Partially Replaces	BS EN 60749:1999
Title	Semiconductor devices. Mechanical and climatic test methods – Die shear strength
Publisher	BSI
Committee	EPL/47
Pages	10
Publication Date	2010-10-31
ISBN	978 0 580 68745 7
Standard Number	BS EN 60749-19:2003+A1:2010
Identical National Standard Of	EN 60749-19:2003/A1:2010, IEC 60749-19:2003/AMD1:2010
Descriptors	Integrated circuits, Substrates (insulating), Quality control, Environmental testing, Strength of materials, Semiconductor devices, Shear testing, Shear strength, Electrical components, Climate, Mechanical testing, Electrical equipment, Electronic equipment and components
Amends	09/30208058 DC, BS EN 60749-19:2003
ICS Codes	31.080.01 - Semiconductor devices in general

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BS EN 60749-19:2003+A1:2010

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