BS EN 61189-11:2013

$102.76

Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Measurement of melting temperature or melting temperature ranges of solder alloys

Published By	Publication Date	Number of Pages
BSI	2013	20

Guaranteed Safe Checkout

Category: BSI

If you have any questions, feel free to reach out to our online customer service team by clicking on the bottom right corner. We’re here to assist you 24/7.
Email:[email protected]

Description

IEC 61189-11:2013 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.

Additional information

Status	Definitive
Pages	20
Publication Date	2013-07-31
ISBN	978 0 580 68869 0
Standard Number	BS EN 61189-11:2013
Title	Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Measurement of melting temperature or melting temperature ranges of solder alloys
Identical National Standard Of	EN 61189-11:2013, IEC 61189-11:2013
Descriptors	Visual inspection (testing), Electrical insulating materials, Environmental testing, Printed circuits, Mechanical testing, Electronic equipment and components, Reports, Solderability testing, Thermal testing, Accuracy, Precision, Printed-circuit boards, Fire tests, Dimensional measurement, Peeling tests, Electrical testing
Publisher	BSI
Committee	EPL/501
ICS Codes	31.180 - Printed circuits and boards

Preview PDF

BS EN 61189-11:2013

$102.76


PDF Format	Searchable	Printable	Preview Now