BS EN 61192-2:2003
$198.66
Workmanship requirements for soldered electronic assemblies – Surface-mount assemblies
Published By | Publication Date | Number of Pages |
BSI | 2003 | 68 |
Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting.