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BS EN IEC 60749-10:2022

BS EN IEC 60749-10:2022

$102.76

Semiconductor devices. Mechanical and climatic test methods – Mechanical shock. device and subassembly

Published By Publication Date Number of Pages
BSI 2022 16
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IEC 60749-10:2022 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test devices in usage conditions as assembled to printed wiring boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation can disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification. This edition cancels and replaces the first edition published in 2002. This edition includes the following significant technical changes with respect to the previous edition:

  1. covers both unattached components and components attached to printed wiring boards;
  2. tolerance limits modified for peak acceleration and pulse duration;
  3. mathematical formulae added for velocity change and equivalent drop height.

PDF Catalog

PDF Pages PDF Title
2 undefined
4 European foreword
Endorsement notice
5 English
CONTENTS
6 FOREWORD
8 1 Scope
2 Normative references
3 Terms and definitions
10 4 Apparatus
5 Procedure
5.1 Apparatus set-up
11 Figure 1 ā€“ Live-bug orientation with solder spheres of device facingdownward in either free or mounted state
Figure 2 ā€“ Dead-bug orientation with solder spheres of devicefacing upward in either free or mounted state
12 5.2 Device or subassembly in free-state
5.3 Subassembly in mounted state
Table 1 ā€“ Device or subassembly free state test levels
13 5.4 Measurements
6 Failure criteria
Table 2 ā€“ Subassembly mounted state test levels
14 7 Summary
15 Bibliography

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BS EN IEC 60749-10:2022
$102.76