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BS IEC 63055:2023

BS IEC 63055:2023

$215.11

Format for LSI-Package-Board Interoperable design

Published By Publication Date Number of Pages
BSI 2023 298
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PDF Catalog

PDF Pages PDF Title
2 undefined
4 Contents
6 FOREWORD
8 Title page
13 IEEE Introduction
15 1. Overview
1.1 Scope
1.2 Purpose
1.3 Key characteristics of the LSI-Package-Board Format
16 1.4 Contents of this standard
17 1.5 Word usage
2. Normative references
3. Definitions, acronyms, and abbreviations
3.1 Definitions
20 3.2 Acronyms and abbreviations
22 4. Concept of the LPB Format
4.1 Technical background
4.2 Conventional design
23 4.3 Common problems at the design site
4.4 Concept of LPB interoperable design
4.5 Value creation by LPB interoperable design
25 4.6 LPB Format
4.7 Summary of LPB Format files
31 5. Language basics
5.1 General
5.2 Typographic and syntax conventions
32 5.3 Character information
5.4 Notation of the floating point number
5.5 File naming definitions
33 6. Common elements in M-Format, C-Format, and R-Format
6.1 General
6.2 The element
34 6.3 The

element
36 6.4 The element
52 7. M-Format
7.1 M-Format file structure
53 7.2 The element
7.3 The element
54 7.4 The element
60 8. C-Format
8.1 C-Format file structure
8.2 The element
165 8.3 The element
169 9. R-Format
9.1 R-Format file structure
170 9.2 The element
205 9.3 The element
215 10. N-Format
10.1 Purpose of the N-Format file
10.2 How to identify the power/ground network
216 10.3 Example
11. G-Format
11.1 Language basics of G-Format
217 11.2 Structure
218 11.3 Header section
219 11.4 Material section
11.5 Layer section
220 11.6 Shape section
224 11.7 Board geometry section
225 11.8 Padstack section
226 11.9 Part section
228 11.10 Component section
229 11.11 Net attribute section
11.12 Netlist section
231 11.13 Via section
232 11.14 Bondwire section
233 11.15 Route section
237 Annex A (informative) Bibliography
239 Annex B (informative) Examples of utilization
B.1 Understanding the function of the LPB Format
B.2 Test bench
241 B.3 Design flow example
273 B.4 Growth of the sample files in the LPB Format
277 B.5 Simulations using the sample files in the LPB Format
279 Annex C (informative) XML Encryption
282 Annex D (informative) MD5 checksum
283 Annex E (informative) Chip-Package Interface Protocol
E.1 General
E.2 Comparison of C-Format with Chip-Package Interface Protocol
288 Annex F (informative) M-Format usage examples
F.1 General
F.2 Bundling files for a product
289 F.3 Bundling files for a library
291 F.4 Managing design versions using M-Format
292 Annex G (informative) Example of how to express the connector parts as terminals
G.1 General

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BS IEC 63055:2023
$215.11