{"id":137622,"date":"2024-10-19T07:57:09","date_gmt":"2024-10-19T07:57:09","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/ashrae-book-powertrends-2ed-2012\/"},"modified":"2024-10-25T00:08:25","modified_gmt":"2024-10-25T00:08:25","slug":"ashrae-book-powertrends-2ed-2012","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/ashrae\/ashrae-book-powertrends-2ed-2012\/","title":{"rendered":"ASHRAE Book PowerTrends 2ed 2012"},"content":{"rendered":"

The Book Datacom Facility Designers Need Now to Be Ready for the Future Datacom equipment technology is advancing at a rapid pace, resulting in relatively short product cycles and an increased frequency of datacom equipment upgrades. Because datacom facilities and their associated HVAC infrastructure are typically built to have longer life cycles, any modern datacom facility needs the ability to seamlessly accommodate the multiple datacom equipment deployments it will experience during its lifetime. Based on the latest information from leading datacom equipment manufacturers, this second edition of Datacom Equipment Power Trends and Cooling Applications provides new and expanded datacom equipment power trend charts through 2020 to allow datacom facility designers to more accurately predict the equipment loads their facilities will need to accommodate in the future and supplies ways of applying the trend information to datacom facility designs today. This edition also enhances the server power trends by including trends for the number of sockets and includes a new chapter with practical information on how to apply the trends in a data center environment. Also included is an overview of various air- and liquid-cooling system options for handling future loads and an invaluable appendix containing terms and definitions used by datacom equipment manufacturers, the facilities operation industry, and the cooling design and construction industry. This book is the second in the ASHRAE Datacom Series, authored by ASHRAE Technical Committee 9.9, Mission Critical Facilities, Technology Spaces and Electronic Equipment. This series provides comprehensive treatment of datacom cooling and related subjects. Keywords: power trend, cooling, air cooling, liquid cooling, datacom, data center<\/p>\n

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
1<\/td>\nDatacom Equipment Power Trends and Cooling Applications, Second Edition
\n <\/td>\n<\/tr>\n
6<\/td>\nContents
\n <\/td>\n<\/tr>\n
8<\/td>\nForeword
\n <\/td>\n<\/tr>\n
10<\/td>\nPreface
\n <\/td>\n<\/tr>\n
12<\/td>\nAcknowledgments
\n <\/td>\n<\/tr>\n
14<\/td>\nChapter 1\u2014Introduction
\n
1.1 Purpose\/Objective <\/td>\n<\/tr>\n
16<\/td>\nChapter 2\u2014Background
\n
2.1 Datacom Facility Planning <\/td>\n<\/tr>\n
17<\/td>\nTable 2.1 Datacom Computer Room Area Breakdown Example <\/td>\n<\/tr>\n
18<\/td>\nFigure 2.1 Datacom computer room area allocation example. <\/td>\n<\/tr>\n
19<\/td>\n2.2 Simple Example of Datacom Equipment Growth Impact on a Facility <\/td>\n<\/tr>\n
21<\/td>\nTable 2.2 5000 ft\u00b2 (465 m\u00b2) Datacom Equipment Room Breakdown\u2014Current Chilled-Water Cooling Load <\/td>\n<\/tr>\n
22<\/td>\nTable 2.3 5000 ft\u00b2 (465 m\u00b2) Datacom Equipment Room Breakdown\u2014 Anticipated Chilled-Water Cooling Load <\/td>\n<\/tr>\n
23<\/td>\nFigure 2.2 Power density comparisons for two scenarios of data center growth. <\/td>\n<\/tr>\n
24<\/td>\n2.3 Overview of Power Density Definitions <\/td>\n<\/tr>\n
25<\/td>\n2.4 IT and Facility Industry Collaboration <\/td>\n<\/tr>\n
26<\/td>\n2.5 IT Industry Background <\/td>\n<\/tr>\n
28<\/td>\nChapter 3\u2014Component Power Trends
\n
3.1 Introduction
3.2 Servers and Their Components <\/td>\n<\/tr>\n
29<\/td>\nFigure 3.1 Processor.
Figure 3.2 1U server processor heat sink.
Figure 3.3 Typical dual in-line memory module (DIMM) with and without a heat spreader. <\/td>\n<\/tr>\n
30<\/td>\nFigure 3.4 Typical dual-socket motherboard. <\/td>\n<\/tr>\n
31<\/td>\nFigure 3.5 Typical compute server rack and packaging. <\/td>\n<\/tr>\n
32<\/td>\nFigure 3.6 Example blade.
Figure 3.7 Example blade server chassis. <\/td>\n<\/tr>\n
33<\/td>\nFigure 3.8 ASHRAE definitions for rack airflow.
3.3 Server Power Distribution
Figure 3.9 Example of power consumption within a server. <\/td>\n<\/tr>\n
34<\/td>\n3.4 Component Power Trends <\/td>\n<\/tr>\n
35<\/td>\nFigure 3.10 Individual processor power trend. <\/td>\n<\/tr>\n
37<\/td>\nFigure 3.11 Server memory power trend. <\/td>\n<\/tr>\n
38<\/td>\nFigure 3.12 Large number of smaller cores in an MIC processor. <\/td>\n<\/tr>\n
39<\/td>\nFigure 3.13 GPU with associated advanced thermal solution. <\/td>\n<\/tr>\n
40<\/td>\nFigure 3.14 Typical HDD subcomponent view. <\/td>\n<\/tr>\n
42<\/td>\nFigure 3.15 Enterprise HDD (LFF 7200 rpm) operating power and power efficiency trend.
Figure 3.16 Enterprise HDD (SFF 10K rpm) operating power and power efficiency trend. <\/td>\n<\/tr>\n
43<\/td>\nFigure 3.17 Peripheral component interconnect (PCI) express solid-state storage card. <\/td>\n<\/tr>\n
44<\/td>\n3.5 Power Supplies <\/td>\n<\/tr>\n
45<\/td>\nFigure 3.18 Enterprise NVM storage power planning guide. <\/td>\n<\/tr>\n
46<\/td>\nFigure 3.19 Example power supply efficiencies.
Figure 3.20 Power supply efficiency improvement example. <\/td>\n<\/tr>\n
48<\/td>\nChapter 4\u2014Load Trends and Their Applications
\n
4.1 Introduction\u2014ASHRAE Updated and Expanded Air-Cooling Power Trends <\/td>\n<\/tr>\n
50<\/td>\n4.2 Definition of Watts per Equipment Square Foot Metric
4.3 The 2005 ASHRAE POWER Trend Chart <\/td>\n<\/tr>\n
51<\/td>\nFigure 4.1 Graphical representation of width \u00d7 depth measurements used for equipment area definitions.
Figure 4.2 The 2005 ASHRAE power trend chart. <\/td>\n<\/tr>\n
52<\/td>\n4.4 POWER Trend Chart Evolution
4.5 Volume Servers <\/td>\n<\/tr>\n
53<\/td>\nFigure 4.3 2005 ASHRAE power trend chart for compute servers. <\/td>\n<\/tr>\n
54<\/td>\nFigure 4.4 1U servers\u20142005 and 2012 trends.
Figure 4.5 2U servers\u20142005 and 2012 trends. <\/td>\n<\/tr>\n
55<\/td>\nFigure 4.6 4U servers\u20142005 and 2012 trends.
4.6 Idle Power For Servers <\/td>\n<\/tr>\n
56<\/td>\nFigure 4.7 Blade servers (7U, 9U, and 10U)\u20142005 and 2012 trends. <\/td>\n<\/tr>\n
57<\/td>\nTable 4.1 Volume Server Power Trends <\/td>\n<\/tr>\n
58<\/td>\nTable 4.2 Power Trends of Nonstandard-Planform Equipment
Figure 4.8 SpecPower trend in idle power. <\/td>\n<\/tr>\n
59<\/td>\nTable 4.3 Idle Power Technologies <\/td>\n<\/tr>\n
60<\/td>\nFigure 4.9 PSU efficiency trends.
4.7 ASHRAE Liquid-Cooling Power Trends <\/td>\n<\/tr>\n
61<\/td>\nFigure 4.10 Liquid-cooled rack power trends.
4.8 Product Cycle vs. Building Life Cycle <\/td>\n<\/tr>\n
62<\/td>\n4.9 Predicting Future Loads
4.10 Provisioning For Future Loads <\/td>\n<\/tr>\n
64<\/td>\nChapter 5\u2014Air Cooling of Computer Equipment
\n
5.1 Introduction <\/td>\n<\/tr>\n
65<\/td>\n5.2 Air Cooling Overview
Figure 5.1 Hot aisle\/cold aisle cooling principle.
5.3 Underfloor Distribution <\/td>\n<\/tr>\n
66<\/td>\nFigure 5.2 Raised-floor implementation most commonly found in data centers using CRAC units.
5.4 Overhead Distribution <\/td>\n<\/tr>\n
67<\/td>\nFigure 5.3 Raised-floor implementation using building air from a central plant.
Figure 5.4 Raised-floor implementation using two-story configuration with CRAC units on the lower floor. <\/td>\n<\/tr>\n
68<\/td>\nFigure 5.5 Overhead cooling distribution commonly found in central office environments.
5.5 Managing Supply and Return Airflows <\/td>\n<\/tr>\n
69<\/td>\nFigure 5.6 Raised-floor implementation using a dropped ceiling as a hot air return plenum.
Figure 5.7 Raised-floor implementation using panels to limit hot aisle\/ cold aisle \u201cmixing\u201d by containing the cold aisle supply.
Figure 5.8 Raised-floor implementation using panels to limit hot aisle\/ cold aisle \u201cmixing\u201d by containing the hot aisle exhaust. <\/td>\n<\/tr>\n
70<\/td>\nFigure 5.9 Raised-floor implementation using inlet and outlet plenums\/ ducts integral to the rack.
Figure 5.10 Raised-floor implementation using outlet plenums\/ducts integral to the rack <\/td>\n<\/tr>\n
71<\/td>\n5.6 Local Distribution <\/td>\n<\/tr>\n
72<\/td>\nFigure 5.11 Local cooling distribution using overhead cooling units mounted to the ceiling.
Figure 5.12 Local cooling distribution using overhead cooling units mounted to the ceiling of the hot aisle.
Figure 5.13 Local cooling distribution using overhead cooling units mounted to the tops of racks. <\/td>\n<\/tr>\n
73<\/td>\nFigure 5.14 Local cooling via integral rack cooling units on the exhaust side of the rack.
Figure 5.15 Local cooling via integral rack cooling units on the inlet side of the rack.
Figure 5.16 Local cooling units interspersed within a row of racks. <\/td>\n<\/tr>\n
74<\/td>\n5.7 Air-Cooling Equipment
5.8 Air-Cooling Controls <\/td>\n<\/tr>\n
76<\/td>\n5.9 Reliability <\/td>\n<\/tr>\n
78<\/td>\nChapter 6\u2014Liquid Cooling of Computer Equipment
\n
6.1 Introduction <\/td>\n<\/tr>\n
79<\/td>\n6.2 Liquid Cooling Overview
6.3 Liquid-Cooled Computer Equipment <\/td>\n<\/tr>\n
80<\/td>\nFigure 6.1 Internal liquid-cooling loop exchanging heat with liquid-cooling loop external to racks.
Figure 6.2 Internal liquid-cooling loop extended to liquid-cooled external modular cooling unit. <\/td>\n<\/tr>\n
81<\/td>\nFigure 6.3 Internal liquid-cooling loop restricted within rack.
6.4 Liquid Coolants for Computer Equipment <\/td>\n<\/tr>\n
83<\/td>\n6.5 Datacom Facility Chilled-Water System <\/td>\n<\/tr>\n
84<\/td>\nFigure 6.4 Typical example of chilled-water loop and valve architecture. <\/td>\n<\/tr>\n
85<\/td>\n6.6 Reliability <\/td>\n<\/tr>\n
86<\/td>\nChapter 7\u2014Practical Example of Trends to Data Center Design
\n
7.1 Introduction <\/td>\n<\/tr>\n
88<\/td>\nTable 7.1 Document Trend Chart Loads\u2014Today and Future Refreshes\u2014 Watts per Chassis and Watts per Cabinet\/Rack <\/td>\n<\/tr>\n
90<\/td>\nTable 7.2 Today and Future Refreshes\u2014Server Types per Zone\u2014Watts per Chassis and Watts per Cabinet\/Rack <\/td>\n<\/tr>\n
91<\/td>\nTable 7.3 Establishing Current ITE Loads
Table 7.4 Establishing the Adjustment Factor to be Applied to Trend Chart Loads <\/td>\n<\/tr>\n
92<\/td>\nTable 7.5 Today and Future Refreshes\u2014Server Types per Zone\u2014Adjusted Watts per Cabinet\/Rack <\/td>\n<\/tr>\n
96<\/td>\nAppendix A\u2014Glossary
\n <\/td>\n<\/tr>\n
114<\/td>\nAppendix B\u2014Additional Power Trend Chart Information\/Data
\n
Figure B.1 1U Servers\u20142005 and 2012 trends (SI units). <\/td>\n<\/tr>\n
115<\/td>\nFigure B.2 2U Servers\u20142005 and 2012 trends (SI units).
Figure B.3 4U Servers\u20142005 and 2012 trends (SI units). <\/td>\n<\/tr>\n
116<\/td>\nFigure B.4 Blade servers (7U, 9U, and 10U)\u20142005 and 2012 trends (SI units). <\/td>\n<\/tr>\n
117<\/td>\nFigure B.5 1U Servers\u20142005 and 2012 trends (non-log scale, I-P units). <\/td>\n<\/tr>\n
118<\/td>\nFigure B.6 2U Servers\u20142005 and 2012 trends (non-log scale, I-P units). <\/td>\n<\/tr>\n
119<\/td>\nFigure B.7 4U Servers\u20142005 and 2012 trends (non-log scale, I-P units). <\/td>\n<\/tr>\n
120<\/td>\nFigure B.8 Blade servers (7U, 9U, and 10U)\u20142005 and 2012 trends (non- log scale, I-P units). <\/td>\n<\/tr>\n
121<\/td>\nFigure B.9 1U Servers\u20142005 and 2012 trends (non-log scale, SI units). <\/td>\n<\/tr>\n
122<\/td>\nFigure B.10 2U Servers\u20142005 and 2012 trends (non-log scale, SI units). <\/td>\n<\/tr>\n
123<\/td>\nFigure B.11 4U Servers\u20142005 and 2012 trends (non-log scale, SI units). <\/td>\n<\/tr>\n
124<\/td>\nFigure B.12 Blade servers (7U, 9U, and 10U)\u20142005 and 2012 trends (non- log scale, SI units). <\/td>\n<\/tr>\n
126<\/td>\nAppendix C\u2014Electronics, Semiconductors, Microprocessors, ITRS
\n
C.1 Cost-Performance Processors <\/td>\n<\/tr>\n
127<\/td>\nFigure C.1 Cost-performance die size.
Figure C.2 Cost-performance power density. <\/td>\n<\/tr>\n
128<\/td>\nFigure C.3 Cost-performance maximum power. <\/td>\n<\/tr>\n
129<\/td>\nFigure C.4 Cost-performance junction temperatures.
Figure C.5 Cost-performance thermal resistance. <\/td>\n<\/tr>\n
130<\/td>\nC.2 High-Performance Processors
Figure C.6 High-performance die size. <\/td>\n<\/tr>\n
131<\/td>\nFigure C.7 High-performance power density. <\/td>\n<\/tr>\n
132<\/td>\nFigure C.8 High-performance maximum power.
C.3 Post CMOS <\/td>\n<\/tr>\n
133<\/td>\nFigure C.9 High-performance junction temperature.
Figure C.10 High-performance thermal resistance. <\/td>\n<\/tr>\n
135<\/td>\nTable C.1 Post-CMOS Research Activities <\/td>\n<\/tr>\n
136<\/td>\nReferences <\/td>\n<\/tr>\n
137<\/td>\nBibliography
\n <\/td>\n<\/tr>\n
138<\/td>\nIndex
\n <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

ASHRAE Datacom Equipment Power Trends and Cooling Applications, 2nd Edition<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
ASHRAE<\/b><\/a><\/td>\n2012<\/td>\n148<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":137624,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[2719],"product_tag":[],"class_list":{"0":"post-137622","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-ashrae","8":"first","9":"instock","10":"sold-individually","11":"shipping-taxable","12":"purchasable","13":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/137622","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/137624"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=137622"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=137622"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=137622"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}