{"id":247274,"date":"2024-10-19T16:16:24","date_gmt":"2024-10-19T16:16:24","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-62496-2-12011\/"},"modified":"2024-10-25T11:22:41","modified_gmt":"2024-10-25T11:22:41","slug":"bs-en-62496-2-12011","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-62496-2-12011\/","title":{"rendered":"BS EN 62496-2-1:2011"},"content":{"rendered":"
IEC 62496-2-1:2011 describes the various methods to measure the optical attenuation and isolation of optical circuit boards (OCBs).<\/p>\n
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
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6<\/td>\n | CONTENTS <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | 1 Scope 2 Normative references 3 Precautions <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | 4 Apparatus 4.1 Launch conditions and source (S) 4.2 Power-meter (D) Table 1 \u2013 Preferred source and launch conditions <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | 4.3 Optical fibre (OF) 4.4 Mode filter (MF) Table 2 \u2013 Preferred launching and receiving fibres <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | 4.5 Optical direction changing device (OD) 4.6 Temporary joint (TJ) <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | 5 Procedure 5.1 Pre-conditioning Figure 1 \u2013 Launch apparatus for butt-joint connection, (a) without OD, (b) with OD <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | 5.2 Visual inspection 5.3 Connectivity inspection 5.4 OCB configurations and measurement methods Table 3 \u2013 Measurement methods of attenuations <\/td>\n<\/tr>\n | ||||||
14<\/td>\n | Table 4 \u2013 Measurement methods of isolations <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | 5.5 Attenuation measurement with a power-meter <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | Figure 2 \u2013 Cut-back method \u2013 Configuration A <\/td>\n<\/tr>\n | ||||||
17<\/td>\n | Figure 3 \u2013 Cut-back method \u2013 Configuration B <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | Figure 4 \u2013 Insertion method (A) \u2013 Configuration A <\/td>\n<\/tr>\n | ||||||
19<\/td>\n | Figure 5 \u2013 Insertion method (A), multi port sequential measurements \u2013 Configuration A <\/td>\n<\/tr>\n | ||||||
20<\/td>\n | Figure 6 \u2013 Insertion method (A) \u2013 Configuration B <\/td>\n<\/tr>\n | ||||||
21<\/td>\n | Figure 7 \u2013 Insertion method (A) \u2013 Configuration C-1 <\/td>\n<\/tr>\n | ||||||
22<\/td>\n | Figure 8 \u2013 Insertion method (A) \u2013 Configuration C-2 <\/td>\n<\/tr>\n | ||||||
23<\/td>\n | Figure 9 \u2013 Insertion method (A) \u2013 Configuration D <\/td>\n<\/tr>\n | ||||||
24<\/td>\n | Figure 10 \u2013 Insertion method (A) \u2013 Configuration E <\/td>\n<\/tr>\n | ||||||
25<\/td>\n | Figure 11 \u2013 Insertion method (A) \u2013 Configuration E <\/td>\n<\/tr>\n | ||||||
26<\/td>\n | Figure 12 \u2013 Insertion method (B) \u2013 Configuration A <\/td>\n<\/tr>\n | ||||||
27<\/td>\n | 5.6 Isolation measurement with a power-meter Figure 13 \u2013 Insertion method (B) \u2013 Configuration C-1 <\/td>\n<\/tr>\n | ||||||
28<\/td>\n | Figure 14 \u2013 Insertion method (C) \u2013 Configuration A <\/td>\n<\/tr>\n | ||||||
29<\/td>\n | Figure 15 \u2013 Insertion method (C) \u2013 Configuration B <\/td>\n<\/tr>\n | ||||||
30<\/td>\n | Figure 16 \u2013 Insertion method (C) \u2013 Configuration C-1 <\/td>\n<\/tr>\n | ||||||
31<\/td>\n | Figure 17 \u2013 Insertion method (C) \u2013 Configuration D <\/td>\n<\/tr>\n | ||||||
32<\/td>\n | Figure 18 \u2013 Insertion method (C) \u2013 Configuration E <\/td>\n<\/tr>\n | ||||||
33<\/td>\n | Figure 19 \u2013 Insertion method (C) \u2013 Configuration E <\/td>\n<\/tr>\n | ||||||
34<\/td>\n | 5.7 Mirror loss measurement Figure 20 \u2013 Insertion method (D) \u2013 Configuration A <\/td>\n<\/tr>\n | ||||||
35<\/td>\n | 6 Details to be specified Figure 21 \u2013 Mirror loss measurement <\/td>\n<\/tr>\n | ||||||
36<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Optical circuit boards – Measurements. Optical attenuation and isolation<\/b><\/p>\n |