{"id":247862,"date":"2024-10-19T16:19:16","date_gmt":"2024-10-19T16:19:16","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bsi-pd-iec-tr-626582013\/"},"modified":"2024-10-25T11:27:15","modified_gmt":"2024-10-25T11:27:15","slug":"bsi-pd-iec-tr-626582013","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bsi-pd-iec-tr-626582013\/","title":{"rendered":"BSI PD IEC\/TR 62658:2013"},"content":{"rendered":"
This Technical Report covers the roadmap of optical circuit boards, and its related packaging technologies including optical circuit board connectors and optical modules on boards.<\/p>\n
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
---|---|---|---|---|---|---|---|
4<\/td>\n | CONTENTS <\/td>\n<\/tr>\n | ||||||
5<\/td>\n | FOREWORD <\/td>\n<\/tr>\n | ||||||
7<\/td>\n | 1 Scope 2 General 2.1 Background of optical packaging technology road map <\/td>\n<\/tr>\n | ||||||
8<\/td>\n | Figures Figure 1 \u2013 Data transmission speed and capability trends for network traffic and server systems [2] <\/td>\n<\/tr>\n | ||||||
9<\/td>\n | 2.2 Advantages of optical interconnects Figure 2 \u2013 Internet traffic and router power consumption in Japan [5] <\/td>\n<\/tr>\n | ||||||
10<\/td>\n | Figure 3 \u2013 Increase of power consumption in future network <\/td>\n<\/tr>\n | ||||||
11<\/td>\n | 2.3 Planar embedded optical waveguides 3 Standardization of board-level optical packaging 3.1 Role of IEC TC86\/JWG9 (with TC91) Figure 4 \u2013 Comparison of power consumption of 10 Tbps electrical and optical routers <\/td>\n<\/tr>\n | ||||||
12<\/td>\n | 3.2 Optical circuit boards [20] Figure 5 \u2013 Discussion field in IEC TC86\/JWG9 (with TC91) <\/td>\n<\/tr>\n | ||||||
13<\/td>\n | 3.3 Optical backplanes [22] Figure 6 \u2013 Classification of optical circuit boards <\/td>\n<\/tr>\n | ||||||
15<\/td>\n | 3.4 Optical circuit board connectors [23] Figure 7 \u2013 Four types of optical backplane applications <\/td>\n<\/tr>\n | ||||||
16<\/td>\n | 3.5 Opto-electronic modules on boards Figure 8 \u2013 Classification of optical circuit board connectors <\/td>\n<\/tr>\n | ||||||
17<\/td>\n | 3.6 Originating standards Figure 9 \u2013 Classification of optical modules on boards Figure 10 \u2013 De facto-standards in Japan [24] <\/td>\n<\/tr>\n | ||||||
18<\/td>\n | 4 Standardization road map 4.1 Performance trends for optical circuit boards Figure 11 \u2013 Performance trends for optical circuit boards <\/td>\n<\/tr>\n | ||||||
19<\/td>\n | 5 Standardization road map of optical circuit boards Figure 12 \u2013 Standardization roadmap of optical circuit boardand its related optical packaging <\/td>\n<\/tr>\n | ||||||
20<\/td>\n | Bibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Roadmap of optical circuit boards and their related packaging technologies<\/b><\/p>\n |