1.1 This practice covers conditions for nondestructive visual inspection of the surface finish of spooled aluminum and gold wire used for making internal semiconductor device connections and hybrid microelectronic connections.<\/p>\n
1.2 This practice specifies the recommended lighting, magnification, and specimen positioning for inspecting spooled wire under an optical microscope.<\/p>\n
1.3 Photographs ( ) are included in as guides to aid the inspector in identifying particular surface conditions. These photographs are not intended as standards for specifying wire surface quality.<\/p>\n
1.4 The values stated in SI units are to be regarded as the standard. The values given in parentheses are for information only.<\/p>\n
This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the aplicability of regulatory limitations prior to use.<\/p>\n
| PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
|---|---|---|---|---|---|---|---|
| 1<\/td>\n | Scope Referenced Documents Terminology Summary of Practice Significance and Use <\/td>\n<\/tr>\n | ||||||
| 2<\/td>\n | Apparatus FIG. 1 <\/td>\n<\/tr>\n | ||||||
| 3<\/td>\n | Sampling Procedure FIG. 2 <\/td>\n<\/tr>\n | ||||||
| 4<\/td>\n | Report Keywords X1. PHOTOMICROGRAPHS OF TYPICAL WIRE DEFECTS AND OF DEFECT-FREE WIRE SURFACE X1.1 FIG. X1.1 <\/td>\n<\/tr>\n | ||||||
| 5<\/td>\n | FIG. X1.2 FIG. X1.3 <\/td>\n<\/tr>\n | ||||||
| 6<\/td>\n | FIG. X1.4 FIG. X1.5 <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" F584-06e1 Standard Practice for Visual Inspection of Semiconductor Lead-Bonding Wire<\/b><\/p>\n |