{"id":417624,"date":"2024-10-20T06:16:56","date_gmt":"2024-10-20T06:16:56","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bsi-pd-iec-tr-628662014-2\/"},"modified":"2024-10-26T11:42:09","modified_gmt":"2024-10-26T11:42:09","slug":"bsi-pd-iec-tr-628662014-2","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bsi-pd-iec-tr-628662014-2\/","title":{"rendered":"BSI PD IEC\/TR 62866:2014"},"content":{"rendered":"

This Technical Report describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.<\/p>\n

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
4<\/td>\nEnglish
CONTENTS <\/td>\n<\/tr>\n
9<\/td>\nFOREWORD <\/td>\n<\/tr>\n
11<\/td>\nINTRODUCTION <\/td>\n<\/tr>\n
12<\/td>\n1 Scope
2 Electrochemical migration
2.1 Operation failure of electronic and electric equipment
Figures
Figure 1 \u2013 Main causes of insulation degradation in electronic equipment <\/td>\n<\/tr>\n
13<\/td>\n2.2 Name change of migration causing insulation degradation and nature of the degradation
2.2.1 History of naming with migration causing insulation degradation
2.2.2 Process of degradation by migration
2.3 Generation patterns of migration <\/td>\n<\/tr>\n
14<\/td>\nFigure 2 \u2013 Generation patterns of migration <\/td>\n<\/tr>\n
15<\/td>\n3 Test conditions and specimens
3.1 Typical test methods
Tables
Table 1 \u2013 Standards for migration tests <\/td>\n<\/tr>\n
16<\/td>\n3.2 Specimens in migration tests
3.2.1 Design of test specimens
Figure 3 \u2013 Basic comb pattern <\/td>\n<\/tr>\n
17<\/td>\nFigure 4 \u2013 Comb type fine pattern
Table 2 \u2013 Standard comb type pattern (based on IPC-SM-840)
Table 3 \u2013 Comb fine pattern (based on JPCA BU 01) <\/td>\n<\/tr>\n
18<\/td>\nFigure 5 \u2013 ECM group comb type pattern (mm)
Figure 6 \u2013 Comb pattern for insulation resistance of flexible printed wiring board <\/td>\n<\/tr>\n
19<\/td>\nFigure 7 \u2013 Insulation evaluation pattern for through-holes and via holes <\/td>\n<\/tr>\n
20<\/td>\nFigure 8 \u2013 Details of the insulation evaluation pattern of Figure 7 (cross section of 4 and 5)
Figure 9 \u2013 Test pattern of the migration study group
Table 4 \u2013 Dimension of insulation evaluation pattern for through-holes <\/td>\n<\/tr>\n
21<\/td>\n3.2.2 Specifications and selection of specimen materials <\/td>\n<\/tr>\n
22<\/td>\n3.2.3 Remarks on the preparation of specimens
3.2.4 Storing of specimens
3.2.5 Pretreatment of the specimen (baking and cleaning) <\/td>\n<\/tr>\n
23<\/td>\n3.2.6 Care to be taken in handling specimens
3.3 Number of specimens required in a test
3.3.1 Specifications given in JPCA ET 01
Table 5 \u2013 Surface pretreatment to printed wiring board <\/td>\n<\/tr>\n
24<\/td>\n3.3.2 Number of specimens in a test
3.3.3 Number of specimens for the different evaluation purposes of a test
Table 6 \u2013 Number of specimens (JPCA ET 01)
Table 7 \u2013 Approximate number of specimens required depending on the purpose of the test <\/td>\n<\/tr>\n
25<\/td>\n4 Test methods
4.1 General
4.2 Steady state temperature and humidity test and temperature-humidity cyclic test
4.2.1 Purpose and outline of the test <\/td>\n<\/tr>\n
26<\/td>\n4.2.2 Test profile
Figure 10 \u2013 Recommended profiles of increasing temperature and humidity <\/td>\n<\/tr>\n
27<\/td>\nFigure 11 \u2013 Humidity cyclic profile (12 h + 12 h) <\/td>\n<\/tr>\n
28<\/td>\nFigure 12 \u2013 Profiles of combined temperature-humidity cyclic test <\/td>\n<\/tr>\n
29<\/td>\n4.2.3 Test equipment
Figure 13 \u2013 Structure of steady state temperature-humidity test equipment <\/td>\n<\/tr>\n
30<\/td>\n4.2.4 Remarks on testing <\/td>\n<\/tr>\n
31<\/td>\nFigure 14 \u2013 Specimen arrangement and air flow in test chamber
Table 8 \u2013 Ionic impurity concentration of wick (10\u20136) <\/td>\n<\/tr>\n
32<\/td>\n4.3 Unsaturated pressurized vapour test or HAST (highly accelerated temperature and humidity stress test)
4.3.1 Purpose and outline of the test
Figure 15 \u2013 Effective space in a test chamber <\/td>\n<\/tr>\n
33<\/td>\n4.3.2 Temperature-humidity-pressure profile
Figure 16 \u2013 HAST profile <\/td>\n<\/tr>\n
34<\/td>\n4.3.3 Structure of and remarks on the test equipment
Figure 17 \u2013 Two types of HAST equipment and their structures <\/td>\n<\/tr>\n
35<\/td>\nFigure 18 \u2013 Difference in failure time among different test laboratories <\/td>\n<\/tr>\n
36<\/td>\n4.3.4 Remarks on performing HAST
Figure 19 \u2013 Colour difference of specimen surface among different laboratories (130\u00a0\u00b0C\/85\u00a0%RH\/DC 50\u00a0V)
Table 9 \u2013 Insulation covering materials for cables for voltage application <\/td>\n<\/tr>\n
37<\/td>\nFigure 20 \u2013 Resistance and pull-strength of cables used in HAST (130\u00a0\u00b0C 85\u00a0%RH) <\/td>\n<\/tr>\n
38<\/td>\n4.4 Saturated and pressurized vapour test
4.4.1 Purpose and outline of the test
4.4.2 Test profile
4.4.3 Remarks on test performing <\/td>\n<\/tr>\n
39<\/td>\n4.5 Dew cyclic test
4.5.1 Purpose and outline of the test
4.5.2 Dew cycle test temperature-humidity profile
Figure 21 \u2013Difference between unsaturated and saturation control of PCT equipment (relative humidity and average failure time) <\/td>\n<\/tr>\n
40<\/td>\n4.5.3 Structure of the test equipment
4.5.4 Remarks on the test method
Figure 22 \u2013 Temperature-humidity profile of dew cycle test
Table 10 \u2013 Dew cycle test condition <\/td>\n<\/tr>\n
41<\/td>\nFigure 23 \u2013 Structure of dew test equipment <\/td>\n<\/tr>\n
42<\/td>\nFigure 24 \u2013 Dew-forming temperature and dew size <\/td>\n<\/tr>\n
43<\/td>\n4.5.5 An example of migration in the solder flux from the dew cycle test
Figure 25 \u2013 Board surface at the best dew formation condition
Table 11 \u2013 Dew formation condition and dew size
Table 12 \u2013 Dew cycle test condition <\/td>\n<\/tr>\n
44<\/td>\nFigure 26 \u2013 Surface state before test
Figure 27 \u2013 Surface state after 27 h
Figure 28 \u2013 SEM image of specimen surface after the test <\/td>\n<\/tr>\n
45<\/td>\n4.6 Simplified ion migration tests
4.6.1 General
4.6.2 De-ionized water drop method
Figure 29 \u2013 Element analysis of the surface after the test <\/td>\n<\/tr>\n
46<\/td>\nFigure 30 \u2013 Circuit diagram of water drop test
Figure 31 \u2013 Migration generated in the water drop test <\/td>\n<\/tr>\n
47<\/td>\n4.6.3 Diluted solution method
Figure 32 \u2013 Electroerosion test method using the diluted solution <\/td>\n<\/tr>\n
48<\/td>\n4.7 Items to be noted in migration tests
Figure 33 \u2013 Current and concentration of electrolytic solution
Figure 34 \u2013 Precipitation on a specimen and its element analysis <\/td>\n<\/tr>\n
49<\/td>\nTable 13 \u2013 Water quality for test
Table 14 \u2013 Water quality change in steady-state temperature-humidity test (10\u20136) <\/td>\n<\/tr>\n
50<\/td>\nTable 15 \u2013 Ionic impurities in voltage applying cables (10\u20136) <\/td>\n<\/tr>\n
51<\/td>\n5 Electrical tests
5.1 Insulation resistance measurement
5.1.1 Standards of insulation resistance measurement
5.1.2 Measurement method of insulation resistance
Table 16 \u2013 Standards of insulation resistance measurement <\/td>\n<\/tr>\n
52<\/td>\nFigure 35 \u2013 An example of insulation resistance measurement outside of the chamber <\/td>\n<\/tr>\n
53<\/td>\nFigure 36 \u2013 Circuit diagram of insulation resistance measurement <\/td>\n<\/tr>\n
54<\/td>\n5.1.3 Special remarks on insulation resistance measurement
Figure 37 \u2013 Examples of leakage current characteristics <\/td>\n<\/tr>\n
55<\/td>\nFigure 38 \u2013 Relationship insulation resistance with charging time of capacitor mounted boards
Figure 39 \u2013 Comparison of insulation resistance measurement inside and outside a test chamber <\/td>\n<\/tr>\n
56<\/td>\nFigure 40 \u2013 Relative humidity and insulation resistance <\/td>\n<\/tr>\n
57<\/td>\n5.2 Measurement of dielectric characteristics
5.2.1 General
5.2.2 Dielectric characteristics of board surface
Figure 41 \u2013 Effect of interruption of measurement on insulation resistance (variation of insulation resistance with the time left in atmospheric environment) <\/td>\n<\/tr>\n
58<\/td>\n5.2.3 Migration and dielectric characteristics of the printed wiring board surface <\/td>\n<\/tr>\n
59<\/td>\nFigure 42 \u2013 Frequency response of dielectric characteristics of printed wiring board
Figure 43 \u2013 Temperature response of dielectric characteristics of printed wiring board <\/td>\n<\/tr>\n
60<\/td>\nFigure 44 \u2013 Changes of static capacitance and tan \u03b4
\nof a specimen through a deterioration test <\/td>\n<\/tr>\n
61<\/td>\n5.2.4 Evaluation of migration by AC impedance measurement
Figure 45 \u2013 Test procedure of a dielectric characteristics test
Figure 46 \u2013 Comparison of dielectric characteristics of two types of flux <\/td>\n<\/tr>\n
62<\/td>\n6 Evaluation of failures and analysis
6.1 Criteria for failures
Figure 47 \u2013 Measurement principle of EIS (Electrical Insulation System)
Figure 48 \u2013 Gold (Au) plating, non-cleaning <\/td>\n<\/tr>\n
63<\/td>\n6.2 Data analysis
6.2.1 Analysis of experimental data
Figure 49 \u2013 Bath tub curve
Table 17 \u2013 Criteria of migration failure by insulation resistance <\/td>\n<\/tr>\n
65<\/td>\n6.2.2 Relationship of the parameters in the experimental data and an example of the analysis <\/td>\n<\/tr>\n
66<\/td>\n6.2.3 Electric field strength distribution
Figure 50 \u2013 Relation between the variation of insulation resistanceand the weight changes by water absorption <\/td>\n<\/tr>\n
67<\/td>\n6.3 Analysis of specimen with a failure, methods of analysis and case study
6.3.1 General
Figure 51 \u2013 Distribution of electric field between line and plane
Figure 52 \u2013 Distribution of the electric field between lines <\/td>\n<\/tr>\n
68<\/td>\n6.3.2 Cross section
Figure 53 \u2013 Different observations of the same dendrite according todifferent cross section cutting planes <\/td>\n<\/tr>\n
70<\/td>\nFigure 54 \u2013 An example of angle lapping <\/td>\n<\/tr>\n
71<\/td>\nFigure 55 \u2013 Structure analysis of an angle lapped solder resist in the depth direction <\/td>\n<\/tr>\n
72<\/td>\n6.3.3 Optical observation
Table 18 \u2013 Various methods for optical observation of failures <\/td>\n<\/tr>\n
74<\/td>\n6.3.4 Analysis methods
6.3.5 Defect observation and analysis
Table 19 \u2013 Various methods for defect analysis <\/td>\n<\/tr>\n
75<\/td>\nFigure 56 \u2013 Observed images of dendrite with different illumination methods (without solder resist)
Figure 57 \u2013 EPMA analysis of migration (dendrite) on a comb type electrode <\/td>\n<\/tr>\n
76<\/td>\nFigure 58 \u2013 EPMA analysis of migration (dendrite) in the solder resist <\/td>\n<\/tr>\n
77<\/td>\nFigure 59 \u2013 3D shape measuring system
Figure 60 \u2013 Electrodes which migration was generated <\/td>\n<\/tr>\n
78<\/td>\nFigure 61 \u2013 3D observation of electrodes before and after the test <\/td>\n<\/tr>\n
79<\/td>\n6.4 Special remarks on the migration phenomenon after the test
Figure 62 \u2013 3D observation of dendrite
Table 20 \u2013 Board specification and test conditions <\/td>\n<\/tr>\n
80<\/td>\nTable 21 \u2013 Effect of the overlap of electrodes
Table 22 \u2013 Effect of the area of the conductor <\/td>\n<\/tr>\n
81<\/td>\nTable 23 \u2013 Effect of the shape of the tip of the electrodes <\/td>\n<\/tr>\n
82<\/td>\nAnnex A (informative) Life evaluation
A.1 Voltage dependence of life
A.2 Temperature dependence of life
A.3 Humidity dependence of life
A.3.1 General <\/td>\n<\/tr>\n
83<\/td>\nA.3.2 Relation between temperature (\u00b0C), relative humidity (\u00a0%RH) and vapour pressure (hPa)
A.4 Acceleration test of life and acceleration factor
Figure A.1 \u2013 Temperature and saturated vapour pressure
Table A.1 \u2013 Vapour pressure at test temperature and relative humidity <\/td>\n<\/tr>\n
84<\/td>\nA.5 Remarks <\/td>\n<\/tr>\n
85<\/td>\nAnnex B (informative) Measurement of temperature-humidity
B.1 Measurement of temperature and humidity
B.1.1 General
B.1.2 Commonly used temperature-humidity measurement systems and their merits
B.1.3 Requirements for the humidity measurements in a steady-state temperature-humidity test chamber
B.2 Typical methods of temperature and humidity measurement
B.2.1 General <\/td>\n<\/tr>\n
86<\/td>\nB.2.2 Checking procedure for temperature measurement
Table B.1 \u2013 Merits of and remarks on various humidity measuring methods (applicable to steady state temperature-humidity tests) <\/td>\n<\/tr>\n
87<\/td>\nB.2.3 Checking procedure for humidity measurement
Figure B.1 \u2013 Specification of sensors used in the test and their shapes <\/td>\n<\/tr>\n
88<\/td>\nB.2.4 Derivation of temperature in a chamber
Figure B.2 \u2013 Calculation method of the average temperature (humidity), the average maximum temperature (humidity) and the average minimum temperature (humidity) <\/td>\n<\/tr>\n
89<\/td>\nB.2.5 Definition of relative humidity in HAST
Table B.2 \u2013 Derivation of relative humidity from dry-and-wet bulb humidity meter <\/td>\n<\/tr>\n
90<\/td>\nFigure B.3 \u2013 Relative humidity in a pressurized chamber <\/td>\n<\/tr>\n
91<\/td>\nBibliography <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2014<\/td>\n96<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":417635,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[2641],"product_tag":[],"class_list":{"0":"post-417624","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-bsi","8":"first","9":"instock","10":"sold-individually","11":"shipping-taxable","12":"purchasable","13":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/417624","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/417635"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=417624"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=417624"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=417624"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}